2D Material Thermoelectric Structure Reducing Thermal Conductivity
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Solution Overview
Problem
Conventional thermoelectric materials improve energy conversion efficiency by increasing the Seebeck coefficient or electrical conductivity, limiting the ability to enhance the thermoelectric figure of merit (ZT) through other means, and often come with higher manufacturing costs.
Innovation Solution
A thermoelectric material structure comprising a substrate, a spacing layer, and a two-dimensional (2D) material layer, where the 2D material layer has a thermal conductivity less than 10 W/mK, allowing for increased ZT value by reducing thermal conductivity, and featuring a flexible or transparent design with lower manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the Seebeck coefficient or electrical conductivity is increased to improve ZT value, then the thermoelectric conversion efficiency is improved, but the manufacturing cost increases
Solution Approach 1:
The patent changes the thermal conductivity parameter of the 2D material layer to less than 10 W/mK, which is a significant reduction from conventional materials. This parameter change allows achieving high ZT values through thermal conductivity reduction rather than increasing Seebeck coefficient or electrical conductivity, thereby avoiding the associated manufacturing cost increases
Solution Approach 2:
The patent employs composite material structures including substrate, spacing layer, and 2D material layer. The 2D material layer (such as graphene, MoS2, or WSe2) is combined with spacing layers made of different materials (metal nanoparticles, metal oxides, polymers, or ceramics) to create a composite structure that achieves low thermal conductivity while maintaining electrical conductivity, thus improving thermoelectric conversion efficiency without proportionally increasing manufacturing cost
2Reliability
If conventional thermoelectric materials are used to increase Seebeck coefficient or electrical conductivity, then ZT value improves, but the ability to enhance performance through other means is limited
Solution Approach 1:
The patent fundamentally changes the approach by targeting thermal conductivity (k) reduction instead of increasing Seebeck coefficient (α) or electrical conductivity (σ). By selecting 2D materials with inherently low cross-plane thermal conductivity (k < 10 W/mK), the patent opens a new pathway for ZT enhancement that is not constrained by the conventional limitations of adjusting only α or σ
Solution Approach 2:
The patent applies local quality by creating distinct layers with different functional properties: the 2D material layer provides low thermal conductivity, while the spacing layer provides electrical conductivity. This spatial separation of functions allows independent optimization of different parameters, enhancing versatility in performance improvement approaches
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This structure achieves higher thermoelectric conversion efficiency by reducing thermal conductivity, offering customizable characteristics for various applications and lower production costs, while maintaining high ZT values.
Implementation Method 1
a thermal conductivity of the 2D material layer along the direction perpendicular to the surface of the substrate is less than 10 W/mK
Implementation Method 2
Thermoelectric material is a functional material capable of converting thermal energy into electrical energy without the assistance of other specific external forces or mechanical parts
Data Source
AI summary
A thermoelectric material structure includes a substrate, at least one spacing layer, and at least one two-dimensional (2D) material layer. The substrate has a surface. The 2D material layer and the spacing layer are overlapped and disposed on the surface of the substrate. The thermal conductivity of the 2D material layer along the direction perpendicular to the surface of the substrate is less than 10 W/mK.