2D Vapor Chamber Heat Pipe Layout for Faster Heat Spreading

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Solution Overview

Problem

Existing 2D vapor chambers are inefficient in distributing heat generated by electronic components, leading to potential overheating due to limited heat distribution and inadequate cooling.

Innovation Solution

The 2D vapor chamber is enhanced with extension portions and wick structures on heat pipes to increase the surface area for working fluid transport, including evaporator and condenser wicks, and heat pipes with extension wicks to enhance heat dissipation efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If heat is conducted through a limited area of the electronic component to a larger area of the 2D vapor chamber, then heat distribution area is increased, but heat distribution efficiency deteriorates

Engineering Contradiction:
Improveheat distribution areaVSAvoidheat distribution efficiency
Core Design Contradiction:
Area of stationary objectVSProductivity

Solution Approach 1:

The vapor chamber is divided into multiple segments with internal heat pipes arranged in series. Each heat pipe segment contains working fluid that evaporates at the heated end and condenses at the distal end, creating multiple sequential heat transfer pathways. This segmentation allows heat to be distributed more efficiently across the larger area by breaking the single-path conduction into multiple parallel evaporator-condenser cycles, resolving the contradiction between expanded area and distribution efficiency.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Working fluid serves as an intermediary substance that transfers heat from the electronic component through the vapor chamber. The fluid undergoes phase change (evaporation and condensation) to transport heat energy efficiently across the extended area. This intermediary mechanism enables effective heat distribution over the larger surface area without sacrificing efficiency, as the phase change process provides high heat transfer coefficients.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Area of stationary object

If working fluid transport path is extended to cover larger area, then heat distribution coverage is improved, but fluid transport time increases

Engineering Contradiction:
Improveheat distribution coverageVSAvoidfluid transport time
Core Design Contradiction:
Area of stationary objectVSLoss of time

Solution Approach 1:

The transport path is segmented into multiple short evaporator-condenser pairs rather than one long path. Each segment operates independently with its own evaporation and condensation zones, allowing working fluid to complete multiple rapid cycles over the extended area. This segmentation reduces the time required for fluid to traverse the entire heat distribution area by parallelizing the heat transfer process across multiple segments.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The working fluid undergoes periodic evaporation and condensation cycles within each heat pipe segment. This periodic phase change action creates continuous heat transfer waves that rapidly move thermal energy across the extended area. The cyclic nature of evaporation-condensation provides efficient, rapid heat transport that covers the larger area without excessive time delay.

Inventive Principle:
Principle #19Periodic action

3Ease of manufacture

If traditional wick structure is used in heat pipes, then manufacturing simplicity is maintained, but heat dissipation efficiency deteriorates

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidheat dissipation efficiency
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The heat pipes utilize porous wick materials with optimized pore structures to enhance capillary action and working fluid transport. The porous structure increases the surface area for heat transfer and improves fluid distribution within the heat pipe channels. This porous material approach significantly enhances heat dissipation efficiency while remaining compatible with conventional manufacturing processes, resolving the contradiction between manufacturing simplicity and heat dissipation performance.

Inventive Principle:
Principle #31Porous materials

Solution Approach 2:

The heat pipes employ composite structures combining different materials with complementary properties - such as metal matrices with porous coatings or multi-layer wick structures. These composite materials provide both the mechanical strength needed for manufacturing and the thermal properties required for efficient heat dissipation. The composite approach enables high heat dissipation efficiency to be achieved without compromising manufacturing feasibility.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The enhanced 2D vapor chamber improves thermal performance by up to 20-30% through increased heat dissipation and efficient working fluid transport, preventing overheating of electronic components.

Implementation Method 1

The pipe wick structure is coupled to the evaporator wick structure... speeds up transport of working fluid back to a heat source

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 2

The generated heat of the electronic component is conducted through a limited area of the electronic component to a larger area of the 2D vapor chamber

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

The interior cavity includes a heat transfer portion and a vapor portion... The plurality of heat pipes respectively includes an inner chamber surface and a pipe wick structure

Methodology Applied
Scientific EffectPhase change: Phase Change

Implementation Method 4

The condenser wick structure is disposed on the second surface... Each plurality of heat pipes respectively abuts each plurality of second cut outs and the second plate perimeter portion

Methodology Applied
Scientific EffectCondensation: Condensation

Data Source

PatentEP4597020A12d vapor chamber
Publication Date: 2025.08.06 PURPLE CLOUD DEV PTE LTD
  • EP4597020A1 patent drawingFigure 1A
  • EP4597020A1 patent drawingFigure 1B
  • EP4597020A1 patent drawingFigure 2

AI summary

A 2D vapor chamber may include a first plate, evaporator wick structure, second plate, condenser wick structure, and plurality of heat pipes. The first plate includes a first surface and plurality of chamber walls extending from the first surface and having second and third chamber walls. The evaporator wick structure is disposed on the first surface. The condenser wick structure is disposed on a second surface of the second plate. The plurality of heat pipes includes a plurality of second heat pipes disposed through the second chamber wall and plurality of third heat pipes disposed through the third chamber wall. The second plate is coupled to the plurality of chamber walls and plurality of heat pipes. Each plurality of heat pipes includes an inner chamber surface and pipe wick structure. The pipe wick structure is disposed on the inner chamber surface and coupled to the evaporator wick structure.