2K Hybrid Adhesive Composition for Electrical Debonding
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Solution Overview
Problem
Existing adhesive compositions are difficult to disassemble without damaging the substrates, and existing debonding methods are time-consuming or require harsh conditions that can damage the substrates.
Innovation Solution
A two-part (2K) hybrid adhesive composition comprising epoxy resin, (meth)acrylate monomer, electrolyte, solubilizer, and filler, which can be debonded by applying an electrical potential across the cured adhesive.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive bonds are used to join substrates, then bonding strength and joint sealing are improved, but disassembly becomes difficult and substrate damage occurs during removal
Solution Approach 1:
The adhesive composition changes its properties through electrolyte dissolution and ionic conduction when electrical potential is applied. The electrolyte (e.g., lithium perchlorate, tetraethylammonium perchlorate) dissolves in moisture within the adhesive, enabling ion transport that disrupts adhesive bonds when voltage is applied, allowing controlled disassembly without mechanical damage to substrates
Solution Approach 2:
The patent replaces mechanical disassembly methods (sand blasting, wire brushing) with an electrical field-based disassembly mechanism. By applying electrical potential across the adhesive layer, faradaic reactions occur at the electrodes that generate ions which disrupt the adhesive bonds, substituting mechanical force with electrical/chemical action for non-contact, substrate-safe disassembly
2Ease of repair
If chemical or high temperature methods are used to debond adhesive, then debonding effectiveness is improved, but substrate damage and process complexity increase
Solution Approach 1:
The patent substitutes harsh chemical solvents and high temperature thermal methods with an electrical field-based disassembly mechanism. Electrical potential applied across the adhesive layer triggers faradaic reactions that generate ions to disrupt bonds, providing a non-contact, substrate-safe alternative that avoids chemical corrosion and thermal damage
Solution Approach 2:
The electrolyte acts as an intermediary substance that enables controlled disassembly. When electrical potential is applied, the electrolyte dissolves in adhesive moisture and conducts ions between electrodes, mediating the energy transfer from electrical field to chemical bond disruption without requiring direct contact with harsh external chemicals or extreme temperatures
3Ease of repair
If electrolyte is added to enable electrical debonding, then debondability is improved, but adhesive composition complexity increases
Solution Approach 1:
The electrolyte component serves multiple functions simultaneously: it acts as a plasticizer to maintain adhesive flexibility, provides ionic conductivity for electrical debonding, and participates in faradaic reactions during disassembly. This multi-functionality reduces the need for separate additives and simplifies the overall formulation despite the added capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition provides effective bonding and can be conveniently debonded by applying an electrical potential, maintaining substrate integrity.
Implementation Method 1
the electrolyte provides sufficient ionic conductivity to the composition to support a faradaic reaction at a bond formed between the composition and an electrically conductive surface
Implementation Method 2
the electrolyte provides sufficient ionic conductivity to said composition to support a faradaic reaction at a bond formed between the composition and an electrically conductive surface and thus allows the composition to disbond from the surface
Data Source
AI summary
The present invention is directed to a curable and debondable two-part (2K) hybrid adhesive composition comprising: i) a first part comprising: a) epoxy resin; b) (meth)acrylate monomer; c) an electrolyte; d) a solubilizer; and e) a filler; and, ii) a second part comprising: a) a curing agent consisting of at least one compound possessing at least two epoxide reactive groups per molecule; b) an accelerator; and, c) a filler.