2XD Module Assembly With Embedded Bridges for Alignment Stability
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Solution Overview
Problem
Current multi-chip architectures face challenges with alignment issues and increased costs due to the use of interposers and embedded bridges, which require large areas and are susceptible to warpage, leading to manufacturability issues.
Innovation Solution
The development of multi-chip modules with high density interconnect bridges that utilize a dimensionally stable carrier for alignment, embedded in a mold layer, allowing for easier assembly and integration with a redistribution layer, and enabling stacking through through silicon vias (TSVs), along with flexible pad designs to accommodate misalignments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an interposer is used to provide electrical coupling between multiple dies, then electrical connectivity is achieved, but the area increases and cost increases
Solution Approach 1:
The patent extracts the interposer function by embedding bridge dies directly into the package substrate, eliminating the need for a separate interposer component. This reduces the overall area while maintaining electrical coupling between multiple dies through the embedded bridge structure
Solution Approach 2:
The patent merges the interposer function with the package substrate by embedding bridge dies directly into the substrate. This consolidation eliminates the separate interposer layer and reduces the total package area while achieving the same electrical coupling objective
2Productivity
If embedded bridges are provided in the package substrate, then high density routing is achieved, but alignment issues occur due to warpage
Solution Approach 1:
The patent applies preliminary action by pre-assembling the bridge dies with the dies to be connected on a carrier before embedding them in the package substrate. This pre-assembly establishes precise alignment relationships that are maintained during the embedding process, overcoming warpage-induced misalignment
Solution Approach 2:
The patent introduces a carrier as an intermediary component that temporarily holds the bridge dies and connects them to the target dies. This carrier serves as a stable reference platform that maintains alignment precision during assembly, which is then transferred to the final embedded structure
3Adaptability or versatility
If multiple bridge dies are used for high density routing, then routing capacity increases, but alignment difficulty increases
Solution Approach 1:
The patent applies preliminary action by pre-assembling multiple bridge dies with the target dies on a carrier before final embedding. This pre-assembly process establishes all alignment relationships in one operation, reducing the complexity of aligning multiple bridge dies individually during substrate embedding
Data Source
AI summary
Embodiments disclosed herein include electronic package and methods of forming such packages. In an embodiment, an electronic package comprises a mold layer and a first die embedded in the mold layer. In an embodiment, the first die comprises first pads at a first pitch and second pads at a second pitch. In an embodiment, the electronic package further comprises a second die embedded in the mold layer, where the second die comprises third pads at the first pitch and fourth pads at the second pitch. In an embodiment, a bridge die is embedded in the mold layer, and the bridge die electrically couples the second pads to the fourth pads.