3-Axis Magnetic Sensor Package With Sloped Z-Axis Substrate
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Solution Overview
Problem
Current magnetic sensing devices are limited to one or two-axis configurations, which restrict their ability to accurately measure magnetic fields in three-dimensional spaces, hindering applications that require comprehensive directional sensing.
Innovation Solution
A 3-axis magnetic sensor package is fabricated with X-axis and Y-axis sensors on one side of a substrate and a Z-axis sensor on an opposing side, featuring sloped surfaces for orthogonal measurement, and is mechanically and electrically connected to a circuit board using conductive bumps and wires or vias for efficient signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If magnetic sensing devices use only one or two-axis configurations, then the device complexity is reduced and manufacturing is simplified, but the measurement precision and ability to accurately measure magnetic fields in three-dimensional spaces is limited
Solution Approach 1:
The patent combines three orthogonal magnetic sensing elements (X, Y, and Z axes) into a single integrated sensor package mounted on a common substrate. This merging approach enables comprehensive 3D magnetic field measurement while maintaining a compact form factor, resolving the contradiction between measurement precision and device complexity by achieving full 3D sensing capability in an integrated architecture rather than as separate discrete components
Solution Approach 2:
The patent transitions from traditional planar 2-axis sensing to 3-axis sensing by adding the Z-axis element oriented perpendicular to the substrate surface. This dimensional extension allows the sensor to measure magnetic field components in all three spatial dimensions, improving measurement precision by capturing the full 3D magnetic field vector while maintaining a compact integrated structure
2Volume of moving object
If multiple magnetic sensing elements are integrated on a single substrate, then the device compactness is improved, but the manufacturing precision and alignment accuracy become more difficult to achieve
Solution Approach 1:
The patent employs preliminary action by pre-positioning the three magnetic sensing elements at precisely determined locations on the substrate during the fabrication process. The elements are oriented along orthogonal axes with predetermined spacing and angular relationships established before final assembly, ensuring accurate spatial relationships and reducing alignment errors that would otherwise occur during later assembly stages
Solution Approach 2:
The patent applies local quality by optimizing the positioning and orientation of each magnetic sensing element according to its specific functional requirements. Each element is placed at a specific location with a specific orientation (X-axis horizontal, Y-axis horizontal perpendicular to X, Z-axis vertical) to maximize its sensing capability in its respective direction, allowing the integrated package to achieve high manufacturing precision for each individual element while maintaining overall compactness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and comprehensive measurement of magnetic fields in three-dimensional spaces, enhancing applications such as navigation and proximity detection by providing a robust and integrated multi-axis sensing capability.
Implementation Method 1
Magnetoresistive material is a material with a variable resistance value that varies depending in part on a magnetic field in proximity to the magnetoresistive material
Implementation Method 2
One surface is mechanically and electrically bonded to a circuit board via conductive bumps. The other surface electrically connects to the circuit board through bonded wires and/or vias formed through the substrate
Data Source
AI summary
A multi-axis magnetic or other field sensing device and method of fabricating a multi-axis magnetic or other field sensing device. An example sensing device is a 3-axis sensor package on a substrate with sensors on opposing sides of the substrate. One side of the substrate includes an X-axis sensor and a Y-axis sensor (or alternatively an integrated X-Y-axis sensor) and the opposite side of the substrate includes a Z-axis sensor on at least one sloped surface, the surface sloped with respect to both the first and second surface areas. One surface is mechanically and electrically bonded to a circuit board via conductive bumps. The other surface electrically connects to the circuit board through bonded wires and/or vias formed through the substrate.