300 GHz Array Antenna Stacking for Beamforming Circuit Layout
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Solution Overview
Problem
The challenge of miniaturizing transceiver circuits for array antennas operating in the 300 GHz band is exacerbated by the difficulty in placing passive elements like inductance and capacitance elements due to the narrow area required for antenna element placement, which is half the wavelength of radio waves, making it difficult to adopt array antennas for transceivers using this frequency band.
Innovation Solution
An array antenna device with a stacked structure comprising a first layer of antenna elements and a second layer with mixers, LO and IF signal lines, and phase shifters, where these components are placed outside the grid areas to accommodate larger circuit elements, allowing for beamforming and beam sweeping capabilities while minimizing heat trapping and signal attenuation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If antenna elements are arranged at half-wavelength pitch (500 μm) for 300 GHz band operation, then antenna gain and beamforming capability are improved, but circuit placement area becomes insufficient for accommodating transceiver circuits with passive elements
Solution Approach 1:
The patent transitions from a planar two-dimensional layout to a three-dimensional stacked configuration. Antenna elements are placed on a first substrate while transceiver circuits are placed on a second substrate positioned at a different height, effectively utilizing the vertical dimension to resolve the area conflict between antenna array spacing requirements and circuit placement needs.
Solution Approach 2:
The patent divides the integrated antenna-circuit system into separate functional modules: antenna elements on the first substrate and transceiver circuits on the second substrate. This segmentation allows each component to be optimized independently for its specific function while maintaining electrical connectivity through conductive structures between layers.
2Area of stationary object
If transceiver circuits are miniaturized to fit in narrow areas, then circuit area is reduced, but passive elements like inductance and capacitance elements become difficult to place
Solution Approach 1:
By moving passive elements and transceiver circuits to a second substrate in the vertical dimension, the patent provides sufficient planar area on each substrate for proper element placement and routing, eliminating the manufacturing difficulties associated with miniaturized circuits on constrained two-dimensional spaces.
3Power
If array antenna is adopted for 300 GHz band transceiver, then output power and received power are improved, but heat dissipation becomes challenging due to compact circuit placement
Solution Approach 1:
The stacked configuration separates heat-generating transceiver circuits from antenna elements by positioning them on different substrates at different heights. This vertical separation improves thermal management by reducing heat trapping and facilitating heat dissipation pathways, while maintaining the high output power capability of the array antenna system.
Data Source
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AI summary
Provided is an array antenna device that can be used in a 300 GHz band. An array antenna device 100 comprises: a first layer 10 in which a plurality of antenna elements 11 are arranged in a grid shape; and a second layer 20 stacked on the first layer 10. The second layer 20 includes: a plurality of mixers 21 that are arranged in a plurality of grid regions 30 overlapping the plurality of antenna elements 11 in plan view, that each include an LO signal terminal 23, an IF signal terminal 24, and an RF signal terminal 22, with the RF signal terminals 22 electrically connected to the plurality of antenna elements 11; a plurality of LO signal lines 25 which are provided to respective columns of the plurality of mixers 21 and to each of which the LO signal terminals of mixers 21 of the same column are commonly connected; and a plurality of IF signal lines 27 that are provided to respective rows of the plurality of mixers 21 and to each of which the IF signal terminals of mixers 21 of the same row are commonly connected.