3D Antenna-in-Package Structure for Wider 28 GHz Bandwidth
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in implementing a 5G millimeter-wave antenna in package (AiP) is the limited vertical polarization current path and bandwidth due to the strict thickness constraints, which hinder effective communication quality, especially at the 28 GHz frequency band.
Innovation Solution
The proposed antenna in package apparatus incorporates a first and second radiator connected by a metal piece, increasing the equivalent height and vertical polarization current path, thereby enhancing the antenna's gain and bandwidth. This is achieved by distributing the vertical polarization current across the radiators and metal pieces, and using additional feeding paths and metal pieces to further increase the effective height and feeding efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of the antenna in package is reduced to meet miniaturization requirements, then the device size is reduced, but the vertical polarization current path becomes too short to achieve sufficient bandwidth
Solution Approach 1:
The patent transitions from a single-substrate two-dimensional antenna structure to a multi-substrate three-dimensional structure. By stacking multiple substrates and placing radiators on different planes connected by metal pieces (via holes), the antenna achieves vertical polarization current paths that extend through the third dimension (thickness direction), thereby increasing the effective current path length while maintaining a compact overall thickness.
Solution Approach 2:
The patent divides the antenna structure into multiple independent segments: first substrate with first radiator, second substrate with second radiator, and metal pieces connecting them. This segmentation allows each component to be optimized independently while collectively achieving the required bandwidth through their combined vertical polarization current paths.
2Ease of operation
If bending processing is applied to the end-fire antenna to implement vertical polarization in thin packages, then vertical polarization is achieved, but the effective current path is shortened, limiting bandwidth
Solution Approach 1:
Instead of bending the antenna element within a single plane (which shortens the current path), the patent extends the current path vertically through multiple substrates connected by metal pieces. This three-dimensional arrangement maintains a long effective current path for vertical polarization while keeping the horizontal footprint small.
3Adaptability or versatility
If the antenna structure is extended to increase the vertical polarization current path, then bandwidth is improved, but the device thickness increases
Solution Approach 1:
The patent embeds multiple functional layers within a compact stacked configuration. The first and second substrates with their radiators are nested vertically, connected by metal pieces that serve as both structural support and electrical interconnects. This nesting allows the antenna to achieve an extended effective current path (improved bandwidth) while maintaining a constrained physical thickness.
Solution Approach 2:
The patent resolves the thickness-bandwidth contradiction by utilizing the vertical dimension (third dimension) efficiently. Multiple radiators are positioned at different heights along the vertical axis, connected by metal pieces, creating a three-dimensional current distribution that achieves long effective current path length (for bandwidth) within a limited physical thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly increases the gain and bandwidth of the antenna, enabling better communication quality by effectively utilizing the limited space and meeting the bandwidth requirements of 5G millimeter-wave frequencies.
Implementation Method 1
a first radiator 330 and a second radiator 340 that have a same direction, and wherein the first radiator 330 and the second radiator 340 are electrically connected by using a first metal piece 350 disposed between the first substrate 300 and the second substrate 260
Data Source
AI summary
This disclosure discloses high-bandwidth antenna in package (AiP) apparatuses. In an example, an AiP apparatus comprises: a first radiator; a second radiator; a first substrate; a second substrate; a first metal piece; and a first feeding path, wherein the first radiator and the first feeding path are disposed on the first substrate, wherein the second radiator is disposed on the second substrate, wherein the first feeding path is configured to feed the first radiator, and wherein the second radiator and the first radiator are connected using the first metal piece disposed between the first substrate and the second substrate.