3D Antenna Package Layout for Compact Multi-Frequency 5G Modules

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Solution Overview

Problem

Conventional wireless communication modules with planar antenna structures face limitations in meeting the requirements of 5G systems due to restricted wiring space and difficulty in miniaturization, as they cannot provide the necessary electrical functions for high-frequency operations and are hindered by increased width when attempting to enhance antenna configurations for improved signal quality and transmission speed.

Innovation Solution

The electronic package incorporates a substrate with recesses of varying depths on one surface and corresponding antenna layers on the other, electromagnetically coupled to antenna feed lines, allowing for adjustable electromagnetic coupling distances and improved radiation efficiency, enabling the transmission of multiple frequencies within a predetermined size, thus meeting the demands of 5G systems while minimizing module size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the layout area on the substrate surface is increased to form multi-frequency antenna bodies, then the antenna configuration capability is improved, but the module width increases and miniaturization is hindered

Engineering Contradiction:
Improveantenna configuration capabilityVSAvoidmodule width
Core Design Contradiction:
Adaptability or versatilityVSLength of stationary object

Solution Approach 1:

The patent transitions from planar two-dimensional antenna layout to three-dimensional stacked configuration. Multiple antenna bodies are formed at different heights above the substrate surface, enabling multi-frequency operation without increasing the substrate footprint. This vertical dimensionality change resolves the contradiction between antenna configuration capability and module width.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements nested antenna structures where smaller antenna bodies are positioned within or adjacent to larger ones in the vertical stacking arrangement. This nesting enables multiple antenna functions to coexist in a compact space, improving adaptability while maintaining compact module dimensions.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Adaptability or versatility

If the substrate width is increased to accommodate more wiring layers, then the electrical functions for 5G operation are improved, but the module size increases

Engineering Contradiction:
Improveelectrical functions for 5G operationVSAvoidmodule size
Core Design Contradiction:
Adaptability or versatilityVSVolume of moving object

Solution Approach 1:

The patent moves wiring and antenna structures from a planar layout to a three-dimensional stacked configuration. Multiple wiring layers and antenna bodies are arranged vertically, enabling enhanced electrical functionality for 5G operation without increasing the module's footprint or overall volume.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Ease of manufacture

If the antenna structure is made planar with fixed substrate dimensions, then the fabrication is simplified, but the wiring space and antenna functions are limited

Engineering Contradiction:
Improvefabrication simplicityVSAvoidantenna functions
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent segments the antenna structure into multiple independent antenna bodies formed at different heights. Each antenna body can be independently designed and fabricated, maintaining fabrication simplicity while enabling diverse antenna functions through the stacked configuration.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances the radiation efficiency and electric field intensity of the antenna, allowing for efficient signal transmission and meeting the requirements of RF products with multiple frequencies, thereby facilitating miniaturization and replacing multiple packaging modules with different frequencies, while maintaining a compact product size.

Implementation Method 1

the first antenna layers are electromagnetically coupled to the antenna feed lines and the second antenna layers

Methodology Applied
Scientific EffectElectromagnetic coupling: Electromagnetic Induction

Data Source

PatentUS12057618B2Electronic package and fabrication method thereof
Publication Date: 2024.08.06 SILICONWARE PRECISION IND CO LTD
  • US12057618B2 patent drawing
  • US12057618B2 patent drawing
  • US12057618B2 patent drawing

AI summary

An electronic package is provided and includes a first carrier structure having a plurality of antenna feed lines, and an antenna module disposed on the first carrier structure. The antenna module includes a substrate body having a plurality of recesses with different depths. Further, antenna layers are formed in the plurality of recesses and electromagnetically coupled to the antenna feed lines so as to improve the overall radiation efficiency of the antenna assembly.