3D Antenna With Raised Conductive Tracks
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Miniature antennas face challenges in maintaining efficiency due to electromagnetic coupling issues when reduced in size, particularly in portable devices, where traditional methods like folding or using ceramic materials for spacing are inefficient and costly.
Innovation Solution
The method involves forming antennas with separate conductive tracks and connection elements on a substrate, using overmolding with a polymer material to create a raised structure and vias for electrical connection, allowing for optimized spacing and reduced coupling without increasing substrate thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the antenna size is reduced to meet miniaturization requirements, then the device thickness and overall size are reduced, but electromagnetic coupling between antenna strands increases and performance deteriorates
Solution Approach 1:
The patent transitions from planar 2D antenna folding to 3D spatial arrangement by folding antenna strands across multiple layers and connecting them vertically through vias. This dimensional change allows strands to be separated in the thickness direction while maintaining compact footprint, reducing electromagnetic coupling while preserving antenna electrical length for miniaturized devices
Solution Approach 2:
The antenna is divided into multiple separate conductive strands arranged in different spatial layers, connected through vertical vias. This segmentation allows each strand to be positioned optimally to reduce mutual coupling while maintaining the overall antenna radiation pattern and electrical characteristics
2Length of stationary object
If traditional folding methods are used to reduce antenna size, then the device thickness is reduced, but electromagnetic coupling between closely spaced strands increases
Solution Approach 1:
The patent uses 3D multi-layer folding with vertical via connections to separate antenna strands in the thickness direction. This allows the device to maintain small overall thickness while creating sufficient spatial separation between conductive strands through the third dimension, reducing electromagnetic coupling without increasing device footprint
Solution Approach 2:
Dielectric materials and via structures serve as intermediaries between antenna strands, providing electrical connection while maintaining physical separation. The via structures with dielectric insulation act as mediators that allow vertical connectivity while preventing direct electromagnetic coupling between strands on different layers
3Object-affected harmful factors
If ceramic materials are used for spacing between antenna planes, then electromagnetic coupling is reduced, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines the spacing function and electrical connection function into a single integrated via structure. The vias perform both the mechanical spacing between layers and the electrical connection between antenna strands, eliminating the need for separate ceramic spacing materials and reducing manufacturing steps and material costs
Solution Approach 2:
The via structures serve multiple functions simultaneously: they provide mechanical support for layer spacing, electrical connection between antenna strands, and electromagnetic isolation through dielectric insulation. This multi-functionality replaces the single-purpose ceramic spacers with a more efficient integrated solution
Data Source
Figure 1~2b
Figure 3a~3e
Figure 4a~4c
AI summary
The present invention relates to a method of manufacturing a radio frequency signal transmission and/or reception device comprising at least one microelectronic circuit (2), characterized in that it comprises at least one first antenna (50) comprising: • at least one first portion (51) comprising a first plurality of disjoint electrically conductive tracks (51a); • at least one second portion (52) being raised relative to said microelectronic circuit (2) and comprising a second plurality of disjoint electrically conductive tracks; • at least one first plurality of connecting elements (53) of said second portion with said first portion.