3D Stacked Antenna Module Packaging for RF Loss, EMI, and Heat
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing antenna modules face challenges in efficiently integrating radio-frequency (RF) circuitry due to increased electro-magnetic interference (EMI) and heat management issues, particularly in three-dimensional (3D) stacked configurations, which also result in longer signal routing paths and higher insertion losses.
Innovation Solution
The antenna module employs a 3D build-up on mold package design, where first and second die packages are vertically stacked with encapsulating mold layers, minimizing D2D interconnections and incorporating isolation layers and thermal vias for EMI shielding and heat dissipation, respectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If dies are stacked in 3D configuration to reduce signal routing path length, then insertion losses are reduced, but electro-magnetic interference (EMI) between dies increases
Solution Approach 1:
The patent introduces an isolation layer as an intermediary structure between stacked RFIC dies. This isolation layer acts as a mediator that maintains the benefits of short interconnection paths while blocking harmful EMI between adjacent dies, thus resolving the contradiction between reduced insertion loss and increased electromagnetic interference
Solution Approach 2:
The patent extracts the EMI shielding function from the overall package structure and implements it as a separate isolation layer between dies. This allows the EMI protection to be independently optimized without affecting the electrical connection quality, thereby resolving the contradiction between short signal paths and EMI reduction
2Area of stationary object
If multiple RFIC dies are integrated in a single package to reduce device size, then mounting area is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The patent segments the heat dissipation function by providing individual thermal vias for each RFIC die. This segmentation allows each die to have its own dedicated thermal management path, enabling efficient heat dissipation from multiple closely-packed dies without requiring large mounting area
Solution Approach 2:
The patent transitions from planar heat dissipation to three-dimensional thermal management by implementing vertical thermal vias that conduct heat from the die interfaces into the package substrate. This dimensional change allows heat dissipation to occur in the vertical direction, enabling compact packaging while maintaining effective thermal management
3Object-affected harmful factors
If RFIC dies are placed side-by-side in conventional configuration, then EMI is minimized, but signal routing path length increases
Solution Approach 1:
The patent transitions from two-dimensional side-by-side die arrangement to three-dimensional vertical stacking. This dimensional change allows RFIC dies to be positioned directly above each other, dramatically reducing signal routing path length while EMI is controlled through the isolation layer rather than spatial separation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces RF transceiver losses, minimizes EMI, and enhances heat dissipation, thereby optimizing the performance and size of the antenna module.
Implementation Method 1
each comprising a mold layer encapsulating the RFIC die and an isolation layer disposed between the mold layer and the active face of the RFIC die
Implementation Method 2
a thermal via disposed in the mold layer and coupled to the isolation layer
Data Source
AI summary
Antenna modules employing three-dimensional (3D) build-up on mold package to support efficient integration of radio-frequency (RF) circuitry, and related fabrication methods. The antenna module includes a RF transceiver whose circuitry is split over multiple semiconductor dies (“dies”) so different semiconductor devices can be formed in different semiconductor structures. The antenna module is provided as a 3D build-up on mold package to reduce lengths of die-to-die (D2D) interconnections between circuits in different dies. First and second die packages that include respective first and second dies encapsulated in respective first and second mold layers are coupled to each other in a vertical direction in a 3D stacked arrangement with active faces of the first and second dies facing each other to provide a reduced distance between the active faces of the first and second dies. An antenna is stacked on the second die package to provide an antenna(s) for the antenna module.