3D Integrated Antenna Structure for Compact Semiconductor Packaging
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Solution Overview
Problem
The integration of radio frequency devices or antennas in semiconductor devices faces challenges due to size reduction, leading to limited performance and capability.
Innovation Solution
A semiconductor structure is developed with an integrated antenna structure that includes an antenna pad, conductive patterns, and a ground plane, embedded in a redistribution layer (RDL) to enhance performance and reduce size, allowing for efficient electromagnetic wave radiation and transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If antenna size is reduced to meet integration requirements, then device miniaturization is achieved, but antenna performance and capability deteriorate
Solution Approach 1:
The patent transitions the antenna from a planar two-dimensional structure to a three-dimensional structure by adding vertical elements (via structures) that extend through multiple conductive layers. This dimensional change allows the antenna to maintain effective radiating area and performance while reducing the horizontal footprint, thereby achieving miniaturization without sacrificing performance.
Solution Approach 2:
The antenna structure embeds multiple conductive patterns and via structures within each other across different layers of the semiconductor device. The via structures penetrate through conductive layers and connect different conductive patterns, creating a nested configuration where smaller conductive elements are positioned within or between larger structural components, maximizing space utilization.
2Ease of manufacture
If antenna structure is simplified to reduce manufacturing complexity, then ease of manufacture improves, but antenna capability and performance deteriorate
Solution Approach 1:
The antenna structure merges multiple functional elements into a unified design: conductive patterns serve both as signal transmission paths and as radiating elements, while via structures simultaneously provide electrical connection between layers and contribute to the three-dimensional antenna geometry. This consolidation reduces the number of separate components and simplifies the manufacturing process while maintaining antenna capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated antenna structure enables efficient electromagnetic wave radiation and transmission at high frequencies, supporting reduced size and improved performance without significantly increasing manufacturing costs or time.
Implementation Method 1
The integrated antenna structure enables efficient electromagnetic wave radiation and transmission at high frequencies
Data Source
AI summary
A semiconductor structure includes an antenna pad, a ground plane and at least one first conductive pattern. The ground plane is disposed over the antenna pad. The at least one first conductive pattern is disposed between the antenna pad and the ground plane, wherein the antenna pad, the at least one first conductive pattern and the ground plane are overlapped.