3D Antenna Sensor Package Layout for Compact SIP Integration
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Solution Overview
Problem
The large size and high production cost of antenna transceivers in system-in-package (SIP) assemblies for complex electronic systems, such as millimeter wave wireless communication and telecommunication, pose challenges in miniaturization and cost-effectiveness.
Innovation Solution
A method of forming a sensor package that includes a semiconductor chip with a redistribution layer structure forming an antenna transmitter and receiver structure, utilizing through-vias and encapsulants like polybenzoxazole, and a chip pick-and-place process to integrate these components in a compact form, potentially reducing package size and production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a traditional antenna transceiver is used in SIP assembly, then electromagnetic wave transmission and reception capabilities are maintained, but the package size becomes large and production cost increases
Solution Approach 1:
The patent transitions the antenna structure from a planar two-dimensional configuration to a three-dimensional立体 configuration by forming antenna patterns through cross-sectional views at different heights. The antenna transmitter and receiver structures are positioned at different vertical levels (first height and second height), creating a volumetric antenna system that achieves better electromagnetic performance in a compact footprint.
Solution Approach 2:
The patent implements nesting by placing the antenna receiver structure inside or within the spatial envelope of the antenna transmitter structure. The receiver antenna pattern is positioned at a different height level within the same horizontal footprint, allowing the receiver to be nested within the transmitter's volumetric space, thereby reducing overall package size while maintaining both transmission and reception functions.
2Device complexity
If several integrated circuits are assembled in a single SIP package, then system complexity is reduced, but manufacturing complexity and production cost increase
Solution Approach 1:
The patent segments the antenna system into distinct functional components: an antenna transmitter structure and an antenna receiver structure, each formed as separate patterns at different height levels. These segmented structures can be independently designed, manufactured, and tested, simplifying the overall manufacturing process while achieving integrated system functionality.
Solution Approach 2:
The patent creates multi-functional structures where the same substrate and material layers serve multiple purposes: the first and second patterns function as both antenna elements and interconnect structures, the encapsulant provides both structural support and electromagnetic shielding, and the through-vias serve as both mechanical anchors and electrical interconnects between different levels.
Data Source
AI summary
Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.