3D Antenna Structure for Miniaturized Electronic Components
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Solution Overview
Problem
Conventional wireless communication modules face challenges in miniaturization due to the planar-type antenna structure, which requires additional substrate space and complicates the molding process, hindering the integration of the antenna with electronic elements and increasing the module's width.
Innovation Solution
A three-dimensional antenna structure is integrated with the substrate, featuring extending portions on the surfaces and connecting portions within the substrate, allowing the antenna to be disposed in the encapsulant region, thus using a mold size corresponding to the substrate and eliminating the need for additional substrate space, facilitating miniaturization and integration with electronic elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a planar-type antenna structure is used, then the antenna can be fabricated on the substrate, but the antenna body cannot be integrally fabricated with the electronic elements and requires additional substrate space
Solution Approach 1:
The antenna structure transitions from a planar two-dimensional configuration to a three-dimensional configuration by extending portions above and below the substrate surface. The extending portions (12a, 12b) project from opposite surfaces of the substrate, allowing the antenna to be integrated within the encapsulant volume rather than requiring additional planar space on the substrate.
2Ease of operation
If a planar-type antenna structure is used, then the antenna can be disposed on the substrate, but the substrate width must be increased to accommodate the antenna body
Solution Approach 1:
The antenna structure utilizes the third dimension by extending portions (12a, 12b) vertically from the substrate surfaces, converting a planar layout problem into a volumetric solution. This allows the antenna to fit within the existing substrate footprint and encapsulant height, eliminating the need to increase substrate width.
Solution Approach 2:
The antenna structure is nested within the encapsulant volume, with extending portions positioned above and below the substrate. This nested arrangement allows the antenna to share the same spatial envelope as the electronic elements, maximizing space utilization without increasing overall module dimensions.
3Ease of manufacture
If a planar-type antenna structure is used, then the antenna body can be disposed on the substrate, but the encapsulant cannot cover the antenna body
Solution Approach 1:
By extending antenna portions vertically from the substrate surfaces, the antenna becomes embeddable within the encapsulant volume. The extending portions (12a, 12b) are positioned such that the encapsulant can completely surround the antenna body, achieving full coverage and integration.
Data Source
AI summary
An electronic component is provided, which includes a substrate having opposite first and second surfaces and an antenna structure combined with the substrate. The antenna structure has at least a first extending portion disposed on the first surface of the substrate, at least a second extending portion disposed on the second surface of the substrate, and a plurality of connecting portions disposed in the substrate for electrically connecting the first extending portion and the second extending portion. Any adjacent ones of the connecting portions are connected through one of the first extending portion and the second extending portion. As such, the antenna structure becomes three-dimensional. The present invention does not need to provide an additional region on the substrate for disposing the antenna structure, thereby reducing the width of the substrate so as to meet the miniaturization requirement of the electronic component.