3D Antenna Structure for Miniaturized Electronic Package
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Solution Overview
Problem
The challenge in wireless communication modules is the difficulty in fabricating compact and low-profile designs due to the electromagnetic radiation characteristics between planar antenna structures and electronic elements, leading to inefficient packaging processes and increased substrate width.
Innovation Solution
The introduction of a three-dimensional antenna structure with first and second extension layers and a connection portion, which allows the antenna structure to correspond to the package encapsulant's area, facilitating molds to match the substrate size and eliminating the need for additional disposing regions on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a planar antenna structure is used, then the antenna is compact and easy to manufacture, but the electromagnetic radiation characteristics cause difficulty in integral fabrication with electronic elements and require additional disposing regions
Solution Approach 1:
The patent transitions from a planar (2D) antenna structure to a three-dimensional (3D) antenna structure by adding vertical extension layers. The antenna body is extended in the thickness direction with first and second extension layers protruding from opposite surfaces, connected by connection portions. This dimensional change allows the antenna to be integrated within the package encapsulant volume without requiring additional planar disposing regions on the substrate.
2Volume of moving object
If a planar antenna structure is used, then the antenna is compact, but the width of the substrate and wireless communication module cannot be reduced
Solution Approach 1:
The patent utilizes the thickness direction (vertical dimension) to accommodate the antenna structure. The first extension layer protrudes from one surface of the package encapsulant while the second extension layer protrudes from the opposite surface, with connection portions bridging between them. This 3D configuration allows the antenna to occupy vertical space rather than horizontal space, thereby reducing the substrate width and overall module footprint while maintaining compact volume.
3Ease of manufacture
If the package encapsulant corresponds to electronic elements only, then the packaging process is complicated, but the antenna body cannot be encapsulated
Solution Approach 1:
The patent merges the antenna structure with the package encapsulant by making the antenna body an integral part of the encapsulated volume. The first and second extension layers protrude from the package encapsulant surfaces, and the connection portions are disposed within or on the package encapsulant. This integration allows a single mold to encapsulate both the electronic elements and the antenna structure, simplifying the packaging process while ensuring complete encapsulation and protection of all components.
Data Source
AI summary
An electronic package structure is provided, including a substrate, a package encapsulant disposed on the substrate, and an antenna structure corresponding to a disposing area of the package encapsulant and having a first extension layer, a second extension layer disposed on the substrate, and a connection portion disposed between and electrically connected to the first extension layer and the second extension layer. Through the formation of the antenna structure on the disposing area of the package encapsulant, the substrate is not required to be widen, and, as such, the electronic package structure meets the miniaturization requirement.