3D Semiconductor Block Assembly With Vertical Interconnect Routing
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Solution Overview
Problem
Current semiconductor manufacturing and packaging processes face challenges in producing smaller semiconductor devices with higher density and performance, while also achieving efficient electrical interconnection and reduced power consumption.
Innovation Solution
The method involves forming conductive elements with high-density traces in a horizontal orientation, then rotating and mounting them vertically to create 3D blocks. These blocks are integrated with support material and components, and encapsulated to form a reconstituted panel with vertical electrical interconnections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional horizontal interconnection methods are used, then manufacturing process is simple, but device density and performance are limited
Solution Approach 1:
The patent transitions from conventional horizontal interconnections to vertical three-dimensional interconnections. Conductive elements are formed horizontally on a carrier, then the entire structure is rotated 90 degrees to achieve vertical orientation, enabling higher device density by utilizing the vertical dimension for signal routing and component stacking.
Solution Approach 2:
The manufacturing process is divided into distinct stages: forming conductive elements horizontally on a carrier, rotating the structure to achieve vertical orientation, and then completing the device assembly. This segmentation allows each stage to be optimized independently while achieving the overall goal of high-density vertical interconnection.
2Volume of moving object
If device size is reduced for higher density, then power consumption decreases, but manufacturing precision requirements increase
Solution Approach 1:
Conductive elements and support material are formed and precisely aligned in a horizontal orientation on the carrier before rotation. This preliminary formation allows for better control of trace geometry and alignment, as horizontal processing is more straightforward. The entire assembly is then rotated as a unit, preserving the precision already achieved without requiring equally precise vertical formation processes.
3Productivity
If vertical interconnections are implemented, then signal routing efficiency improves, but manufacturing complexity increases
Solution Approach 1:
Instead of attempting to form vertical conductive elements directly (which would be complex), the patent forms horizontal elements first and then inverts the orientation by rotating the entire structure 90 degrees. This inversion approach achieves vertical interconnections with the simplicity of horizontal formation processes, significantly reducing manufacturing complexity while maintaining signal routing efficiency.
Data Source
AI summary
A method of making an assembly or package comprising 3D blocks may include forming a conductive element horizontally oriented over a first carrier, forming support material around the conductive element, and singulating the conductive element and the support material to form a plurality of 3D blocks. The method may further include rotating each of the plurality of 3D blocks and mounting the plurality of 3D blocks over a second carrier with the conductive traces of the 3D blocks vertically oriented to form a vertically oriented conductive element. A plurality of components may be disposed laterally offset from each of the plurality of 3D blocks, an encapsulant may be disposed thereover s to form a reconstituted panel that may be singulated to form a plurality of individual assemblies.