3D Semiconductor Block Assembly with Rotated Vertical Interconnects
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Solution Overview
Problem
Existing semiconductor manufacturing and packaging processes face challenges in producing smaller semiconductor devices with higher density and efficient electrical interconnection, which are essential for smaller footprints and improved performance.
Innovation Solution
A method involving the formation of conductive elements in a horizontal orientation over a carrier, followed by rotation to a vertical orientation, with support material encapsulation, allowing for the creation of 3D blocks with densely packed conductive traces, and subsequent integration with components to form vertically oriented assemblies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional semiconductor packaging processes are used, then manufacturing simplicity is maintained, but device density and interconnection efficiency are limited
Solution Approach 1:
The patent transitions from conventional planar (2D) packaging to three-dimensional (3D) packaging by forming conductive elements in a horizontal orientation and then rotating them to a vertical orientation. This dimensional change enables ultra-high-density interconnects and vertical signal propagation, significantly increasing device density while managing the inherent process complexity through systematic method steps
2Area of moving object
If device size is reduced for smaller footprints, then space efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent performs preliminary actions by forming conductive elements in a horizontal orientation where manufacturing processes are more controllable and precise. The conductive elements are formed, supported, and encapsulated in this stable horizontal state before rotation, ensuring manufacturing precision is maintained during the critical formation phase
3Ease of manufacture
If conductive elements are formed horizontally for ease of manufacture, then manufacturing ease is improved, but vertical interconnection efficiency is reduced
Solution Approach 1:
The patent introduces dynamic reconfiguration by rotating the conductive elements from a horizontal orientation (easy to manufacture) to a vertical orientation (efficient for signal propagation). This dynamic change allows the system to optimize for manufacturing ease during formation and then optimize for signal propagation efficiency in the final vertical configuration, achieving both benefits at different stages
Data Source
AI summary
Disclosed is an assembly comprising a 3D block comprising a support material disposed around a conductive element, where the support material comprises a cut or ground edge and a portion of a wafer, the assembly further comprising at least one component disposed adjacent the 3D block, and an encapsulant disposed around the 3D block and around the at least one component, and a first interconnect structure formed over, and coupled with, first ends of the conductive elements, where the first ends are exposed with respect to the support material.