3D Building Model Discretization for Obstacle-Aware Device Placement
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Solution Overview
Problem
Existing methods for determining the installation positions of electronic devices in buildings, such as fire detection sensors, are labor-intensive, non-scalable, and prone to errors due to the manual handling of obstacles like false ceilings and pipes, leading to costly rearrangements during installation.
Innovation Solution
A computer-implemented method that uses a three-dimensional model of a building to simulate electronic device placements, considering obstacles and optimizing coverage using ray tracing and optimization algorithms to determine optimal installation positions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If manual methods are used to determine installation positions on paper or 2D-CAD plans, then the process can be carried out with simple tools, but the results are arbitrary, non-repeatable, and time-consuming
Solution Approach 1:
The patent replaces manual mechanical marking methods with a computer-implemented automated system that uses 3D building models, algorithms, and software to determine installation positions. This substitution eliminates the arbitrary and non-repeatable nature of manual methods while maintaining accessibility through standard computing devices.
Solution Approach 2:
The patent transitions from 2D-CAD plans to 3D building information models (BIM) for determining installation positions. This dimensional enhancement allows the system to account for obstacles like false ceilings, pipes, and wires that are not visible in 2D representations, thereby improving accuracy and repeatability.
2Device complexity
If 2D-plans or BIM-models are used for determining installation positions, then the planning process is simplified, but obstacles such as false ceilings, pipes, wires or projections are not accurately indicated, leading to costly rearrangements during installation
Solution Approach 1:
The patent utilizes 3D building information models instead of 2D-plans to represent the building structure. This three-dimensional representation enables the system to accurately detect and account for obstacles such as false ceilings, pipes, wires, and projections that are invisible or ambiguous in 2D representations, thereby improving reliability without significantly increasing complexity.
Solution Approach 2:
The patent introduces a computer-implemented algorithm as an intermediary between the building model and the installation planning process. This algorithm automatically analyzes the 3D model to identify obstacles and determine optimal installation positions, eliminating the need for manual interpretation and reducing errors related to missed obstacles.
3Reliability
If multiple electronic sensors are installed to ensure complete monitoring coverage, then the monitoring coverage is improved, but the installation costs and time increase due to dense grid requirements
Solution Approach 1:
The patent changes the approach from uniform dense grid installation to optimized positioning based on 3D spatial analysis. By considering the actual three-dimensional geometry of the building and obstacle locations, the system determines precise installation positions that achieve complete monitoring coverage with fewer sensors, thereby improving installation efficiency while maintaining reliability.
Solution Approach 2:
The patent performs preliminary automated determination of optimal installation positions using 3D building models before the actual installation process. This advance planning identifies the minimum number of sensors required and their precise locations, preventing unnecessary installations and reducing both costs and time while ensuring complete coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces the need for manual adjustments and minimizes installation costs by automatically determining optimal positions that account for building obstacles, ensuring comprehensive coverage and efficient placement of electronic devices.
Implementation Method 1
simulating placements of the electronic device at valid installation positions within the area, thereby determining a preferably weighted monitoring and/or serving coverage of the electronic device for each simulated valid installation position, preferably by means of raytracing
Data Source
AI summary
A method for determining an optimal installation position of an electronic device in an area of a building, the electronic device being configured to monitor and/or serve the area, comprising the following steps: Providing a representation of the building, wherein the area comprises at least one building element; Generating data points arranged in a grid; Labelling each data point with a data point label, the data point label providing information if a respective data point is associated with the at least one building element and, if the data point is associated with the at least one building element, about which kind of building element the data point is associated with; Simulating placements of the at least one electronic device at valid installation positions, thereby determining a monitoring and/or serving coverage of the electronic device; and Outputting the optimal installation position with the highest monitoring and/or serving coverage.