3D Capacitor with Anodic Oxide Holes for High Density

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Solution Overview

Problem

Current capacitors face challenges in achieving high capacitance relative to their size, particularly as they are miniaturized, due to increased complexity and process difficulties in manufacturing multi-layer ceramic capacitors with smaller dimensions.

Innovation Solution

A three-dimensional capacitor design utilizing an anodic oxide film with vertically arranged holes and conductors, where the first and second electrode layers are electrically connected to the conductors and separated from each other, allowing for high-density conductor arrangement and efficient electric current supply, thereby achieving high capacitance relative to size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If multi-layer ceramic capacitors are miniaturized, then capacitor size is reduced, but manufacturing complexity increases

Engineering Contradiction:
Improvecapacitor sizeVSAvoidmanufacturing complexity
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent transitions from planar multi-layer stacking to a three-dimensional vertical structure with holes extending through the capacitor body. Conductors are arranged vertically within holes rather than in horizontal layers, fundamentally changing the spatial dimension of conductor arrangement from 2D to 3D, thereby achieving miniaturization without proportionally increasing manufacturing complexity

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The capacitor employs a porous insulating material structure with vertically extending holes that penetrate through the insulating layer. These holes serve as conduits for conductors while the porous structure maintains electrical insulation, enabling compact vertical integration of multiple conductors without requiring complex multi-layer stacking processes

Inventive Principle:
Principle #31Porous materials

2Quantity of substance

If the distance between electrodes decreases, then capacitance increases, but manufacturing difficulty increases

Engineering Contradiction:
ImprovecapacitanceVSAvoidmanufacturing ease
Core Design Contradiction:
Quantity of substanceVSEase of manufacture

Solution Approach 1:

Instead of reducing horizontal electrode spacing, the patent achieves high capacitance by extending conductors vertically through the insulating material. The effective electrode area is increased in the vertical dimension, allowing capacitance enhancement without requiring extremely small horizontal spacing that would be difficult to manufacture

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Multiple conductors are nested vertically within the porous insulating structure, with each conductor positioned in its own hole. This nested arrangement allows multiple capacitive elements to be integrated within a compact volume without requiring precise lateral positioning, simplifying the manufacturing process while maintaining high capacitance

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables easy manufacturing of capacitors with high capacitance and compact size by leveraging the insulating properties of the anodic oxide film and high-density conductor arrangement, facilitating efficient electric current flow.

Implementation Method 1

an anodic oxide film formed of anodizable metal and having a plurality of holes formed therein in a vertical direction

Methodology Applied
Scientific EffectAnodizing: Anodising

Data Source

PatentUS10998136B2Three-dimensional capacitor
Publication Date: 2021.05.04 POINT ENG
  • US10998136B2 patent drawing
  • US10998136B2 patent drawing
  • US10998136B2 patent drawing

AI summary

Provided is a three-dimensional (3D) capacitor including conductors formed at a high density inside holes of an anodic oxide film, and a first electrode layer and a second electrode layer electrically connected to the conductors. Thus, a high capacitance relative to a size of the 3D capacitor may be easily achieved.