3D Capacitor Electrode Structure for High Capacitance Density
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Solution Overview
Problem
Existing capacitor designs face challenges in achieving large capacitance without increasing chip size, as larger capacitor plates are required, making it difficult to shrink chip size and integrate devices effectively.
Innovation Solution
A capacitor design featuring a substrate with a center and peripheral area, where active parts and grooves are etched to form a three-sided capacitor structure with interconnected electrode plates, allowing for increased capacitance density while minimizing the horizontal operation area and reducing the number of conductive plugs needed for electrical interconnection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the capacitor plate area is increased to achieve large capacitance, then the capacitance value is improved, but the chip size increases and device integration becomes difficult
Solution Approach 1:
The patent transitions from traditional planar capacitor structures to three-dimensional vertically-stacked capacitor structures. Multiple electrode plates are stacked in the vertical direction with insulating layers between them, enabling large capacitance to be achieved by utilizing vertical space rather than expanding horizontal area. This dimensional change allows high capacitance density while maintaining small chip footprint.
Solution Approach 2:
The patent implements a nested structure where multiple electrode plates and insulating layers are stacked within a compact vertical space. The capacitor structure consists of nested layers of electrodes and dielectric materials, similar to nested dolls, maximizing the use of vertical operation space to achieve large capacitance without increasing horizontal chip area.
2Device complexity
If the number of conductive plugs is reduced to simplify electrical interconnection, then device complexity is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent merges multiple conductive plugs into a single shared plug structure. The first and second conductive plates are electrically connected through a common conductive plug that extends through the substrate, eliminating the need for separate plugs for each plate. This merging approach reduces the total number of plugs and interconnection complexity while the plug is formed to precisely connect to both plates through controlled etching and filling processes.
Data Source
AI summary
A capacitor includes: a substrate including a center area and a peripheral area surrounding the center area; a plurality of active parts disposed in the center area and the peripheral area; an electrode structure including a first insulation layer, a first electrode plate, a second insulation layer, and a second electrode plate; one or more first openings disposed in the electrode structure in the peripheral area exposing a part of the top surface of each of the plurality of active parts in the peripheral area; one or more second openings disposed in the second electrode plate and the second insulation layer in the peripheral area exposing a part of the surface of the first electrode plate in the peripheral area; and a plurality of first plugs disposed in the one or more first openings and a plurality of second plugs disposed in the one or more second openings.