3D Capacitor Trench Layout With Gas Pockets for Stress Relief

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Solution Overview

Problem

Existing electronic devices with three-dimensional capacitors face challenges in manufacturing due to stress caused by filled cavities, leading to potential deformation and disruption in manufacturing processes, and there is a need for efficient stress absorption without affecting electrical functionality.

Innovation Solution

Incorporating trenches with gas pockets surrounding three-dimensional capacitors in an insulating layer, where the trenches are electrically insulated and designed to absorb stress, allowing for conformal extension of conductive layers within cavities while maintaining structural integrity and avoiding deformation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If three-dimensional capacitors are formed by filling cavities with conductive layers, then capacitance density is improved, but stress-induced deformation and manufacturing disruption occur

Engineering Contradiction:
Improvecapacitance densityVSAvoidmanufacturing reliability
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The device is segmented into capacitor regions (with filled cavities) and trench regions (with gas pockets). This segmentation allows different functional zones: capacitors achieve high density while trenches provide stress relief, preventing deformation and manufacturing disruption.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Gas pockets in trenches act as intermediary stress-absorbing elements between the filled capacitor cavities. These gas-filled spaces absorb mechanical stress without affecting the electrical functionality of the capacitors, preventing stress-induced deformation.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If gas pockets are incorporated in trenches surrounding capacitors, then stress absorption is improved, but device structure becomes more complex

Engineering Contradiction:
Improvestress absorptionVSAvoidstructural complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The trench structure combines multiple functions: electrical insulation (isolating capacitors), stress absorption (via gas pockets), and structural support. By merging these functions into a single integrated feature, the overall device complexity is reduced despite the added functionality.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The trenches serve multiple purposes simultaneously: they provide electrical insulation between capacitors, absorb stress to prevent deformation, and maintain structural integrity. This multi-functionality reduces the need for separate components, offsetting the apparent structural complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Manufacturing precision

If trenches with gas pockets are added around capacitors, then stress-induced deformation is prevented, but manufacturing process complexity increases

Engineering Contradiction:
Improvedeformation controlVSAvoidmanufacturing process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The trenches with gas pockets are formed preliminarily during the manufacturing process, before final capacitor assembly. This preliminary action of creating stress-relief structures prevents deformation during subsequent manufacturing steps, ensuring precision without requiring additional corrective processes.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS20250006782A1Electronic device
Publication Date: 2025.01.02 STMICROELECTRONICS (TOURS) SAS
  • US20250006782A1 patent drawing
  • US20250006782A1 patent drawing

AI summary

The present description concerns an electronic device comprising at least two three-dimensional capacitors, each capacitor being surrounded with a trench comprising a gas pocket.