3D Pattern Card Lamination Using UV Bonding to Prevent Warping

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Solution Overview

Problem

Existing methods for manufacturing three-dimensional patterned credit cards face issues such as shrinkage and warping due to high-temperature pressing, and components like antennas or magnetic stripes leaving marks on the card surface.

Innovation Solution

A method involving the fabrication of separate three-dimensional pattern and rear card body modules, bonded using a UV adhesive, eliminating high-temperature pressing and preventing shrinkage or warping, while enhancing the three-dimensional effect.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If high-temperature pressing process is used to bond sheets, then bonding strength is improved, but shrinkage and warping occur

Engineering Contradiction:

Improvebonding strengthVSAvoidcard shape stability

Core Design Contradiction:

StrengthVSShape

Solution Approach 1:

The patent changes the bonding parameter from high-temperature thermal bonding to UV light curing. The UV-curable adhesive is irradiated with UV light to initiate polymerization and bonding, eliminating the need for high-temperature pressing that causes shrinkage and warping while maintaining adequate bonding strength.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent replaces the thermal bonding mechanism with a photopolymerization mechanism. Instead of using heat to activate bonding, the adhesive is activated by UV light irradiation, which prevents thermal-induced deformation while achieving effective bonding.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Strength

If high-temperature pressing process is used to bond sheets, then bonding strength is improved, but marks from components appear on surface

Engineering Contradiction:

Improvebonding strengthVSAvoidcomponent marks on surface

Core Design Contradiction:

StrengthVSObject-generated harmful factors

Solution Approach 1:

The patent replaces thermal bonding with UV light curing bonding. The UV-curable adhesive remains in a liquid state during assembly, allowing components like antennas and magnetic stripes to be positioned without risk of mark formation. UV irradiation then cures the adhesive without generating heat that would cause component marks.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent applies the UV-curable adhesive in a liquid state before assembling components, allowing precise placement without thermal distortion. The bonding is activated afterward through UV irradiation, ensuring components are set before bonding occurs, preventing mark formation.

Inventive Principle:

Principle #10Preliminary action

3Adaptability or versatility

If three-dimensional pattern is formed on card, then design complexity is improved, but manufacturing complexity increases

Engineering Contradiction:

Improvedesign complexityVSAvoidmanufacturing process complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent divides the card into separate modules: a front sheet with the three-dimensional pattern and a rear sheet with functional components. The UV-curable adhesive allows these modules to be assembled independently and then bonded together, simplifying manufacturing while maintaining design complexity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The UV-curable adhesive acts as an intermediary that enables the assembly of complex three-dimensional patterns without requiring complex manufacturing processes. The adhesive provides a simple bonding mechanism that works with pre-formed three-dimensional structures, separating the design creation process from the assembly process.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution prevents shrinkage and warping of the card, maintains the three-dimensional effect, and avoids component marks on the surface by using UV bonding.

Implementation Method 1

a UV adhesive layer disposed between the three-dimensional pattern module and the rear card body module, the UV adhesive layer being formed by curing an adhesive of a UV-curable material to bond the three-dimensional pattern module and the rear card body module together

Methodology Applied

Scientific EffectUV curing: Photopolymerisation

Data Source

PatentUS20250390697A1Three-dimensional pattern card and method for manufacturing the same

Publication Date: 2025.12.25 BIOSMART CORPORATION

AI summary

Provided is a three-dimensional pattern card and a method of manufacturing the same. The method includes: (a) preparing a master mold in which a pattern of a three-dimensional shape is engraved on one surface; (b) fabricating a three-dimensional pattern module by forming a three-dimensional pattern on a surface of a transparent sheet made of a synthetic resin material using the master mold; (c) fabricating a rear card body module by sequentially laminating and bonding a first core sheet, an antenna inlay sheet, a second core sheet, and a rear protective sheet; (d) applying a UV adhesive to a surface of the first core sheet of the rear card body module; and (e) laminating the three-dimensional pattern module on the UV adhesive applied surface of the rear card body module and irradiating UV to cure the adhesive so as to bond the rear card body module and the three-dimensional pattern module.