3D Structures Bonded Into Thin Ceramic Substrates Without Adhesives
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Solution Overview
Problem
Conventional methods for attaching three-dimensional objects to thin ceramic substrates, such as dielectric resonator antennas, are inadequate due to mechanical stresses and small contact areas, making it difficult to securely attach objects like antennas and pins.
Innovation Solution
A method involving drilling holes in an unsintered ceramic substrate, inserting three-dimensional structures, and sintering to covalently bond them in place, eliminating the need for adhesives.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If glue or adhesives are used to attach three-dimensional objects to thin ceramic substrates, then the attachment process is simple, but the mechanical strength and reliability are insufficient due to small contact area and high mechanical stresses
Solution Approach 1:
Holes are formed in the unsintered ceramic substrate before inserting the three-dimensional object. This preliminary preparation allows the object to be securely positioned and mechanically interlocked with the substrate during sintering, eliminating the need for adhesives and ensuring strong covalent bonding while maintaining simple manufacturing process
Solution Approach 2:
The attachment method transitions from chemical bonding (adhesives) to thermal-chemical bonding (covalent bonding during sintering). By changing the bonding mechanism through temperature parameter change, the attachment strength is significantly improved while maintaining ease of manufacture
2Stability of the object's composition
If holes are formed in sintered ceramic substrate, then the structural integrity is maintained, but the manufacturing complexity increases due to difficulty in forming holes and inserting objects
Solution Approach 1:
Holes are formed in the unsintered ceramic substrate before insertion of the three-dimensional object. This allows the hole formation to be performed when the material is more compliant and easier to process, while the structural integrity is maintained through the subsequent sintering process that bonds the object to the substrate
Solution Approach 2:
The manufacturing process is segmented into distinct stages: hole formation in unsintered substrate, object insertion, and sintering. This segmentation allows each step to be optimized independently, reducing overall manufacturing complexity while maintaining substrate integrity
3Temperature
If adhesives are used for attachment, then no high temperature processing is needed, but the contact area is insufficient and mechanical stresses cause attachment failure
Solution Approach 1:
The bonding mechanism changes from room-temperature adhesive bonding to high-temperature covalent bonding during sintering. This parameter change (temperature) enables direct chemical bonding between the object and substrate, significantly improving attachment reliability while the high temperature is only applied temporarily during the sintering process
Solution Approach 2:
The mechanical adhesion system (glue/adhesives) is replaced with a thermal-chemical bonding system (covalent bonding during sintering). This substitution eliminates the limitations of adhesive bonding and provides superior attachment reliability through direct material-to-material bonding
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Provides a stable and secure attachment of three-dimensional structures to thin ceramic substrates, enhancing mechanical integrity and reducing stress-related issues.
Implementation Method 1
heating the substrate containing the inserted non-planar object to a temperature between 850° C. and 3,000° C. for a time period from 1 to 60 minutes resulting in covalent bonding of the non-planar object to the substrate
Implementation Method 2
sintering the ceramic precursor and inserted structure to covalently bond or lock the structure in place
Implementation Method 3
etching or ablating the hole in the substrate surface using a laser
Data Source
AI summary
Devices and methods having embedded three-dimensional structures in thin ceramic substrates, including but not limited to dielectric resonator antennas (DRAs), and devices used in electronics, radio frequency (RF) antennas, sensors, and other applications. A hole is formed in the surface of an unsintered ceramic substrate, and a three-dimensional object is inserted through the hole and into the substrate. The substrate and inserted object are then heated to high temperatures to sinter the substrate and to covalently bond the object to the substrate, thereby securely attaching the object to the substrate surface generally without a need to use adhesives.