3D Ceramic Power Module Layout for Low Inductance Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Electric power components, such as integrated circuits for power applications, generate excessive heat during operation, posing challenges in efficiently cooling them, especially in scenarios where space is limited.
Innovation Solution
A three-dimensional (3D) cooling structure with multiple planar sides is used, where power components are mounted on multiple sides of the cooling structure, and thermally conductive materials are employed to create an efficient thermal chain for heat dissipation. Additionally, decoupling capacitors are integrated close to the power components, and electrically conductive loops or rings are used to cancel magnetic flux and minimize parasitic inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If bare die ICs are distributed on a cooling plate for cooling, then heat dissipation is achieved, but large space or area is required
Solution Approach 1:
The patent transitions from a two-dimensional arrangement of ICs on a cooling plate to a three-dimensional configuration where ICs are stacked vertically on ceramic substrates. This vertical stacking enables multiple ICs to occupy the same footprint area, dramatically reducing the required cooling plate area while maintaining effective heat dissipation through thermally conductive vias and attached heat sinks.
2Area of stationary object
If power components are mounted on multiple sides of the cooling structure, then space utilization is improved, but manufacturing complexity increases
Solution Approach 1:
The patent divides the power module into discrete functional units: ceramic substrates with mounted ICs, cooling structure with heat sinks, and interconnection elements. Each substrate can be prepared and populated independently, then assembled into the final multi-sided configuration. This segmentation enables modular manufacturing, reducing overall complexity despite the three-dimensional arrangement.
Solution Approach 2:
The ceramic substrates serve multiple functions simultaneously: they provide mechanical support for ICs, electrical insulation between conductive elements, thermal conduction paths to the cooling structure, and structural framework for the multi-sided mounting. This multi-functionality reduces the number of separate components needed, simplifying manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient heat removal and dissipation from electric power components, reduces the overall size of the power package, and improves parasitic properties by integrating decoupling capacitors and canceling magnetic flux.
Implementation Method 1
thermally conductive materials are employed to create an efficient thermal chain for heat dissipation
Implementation Method 2
electrically conductive loops or rings are used to cancel magnetic flux and minimize parasitic inductance
Data Source
AI summary
Approaches, techniques, and mechanisms are disclosed for packaging electric power components. A power module comprises: a three-dimensional (3D) cooling structure that has a plurality of planar sides; a first set of mountable power components that are mounted on a first planar side in the plurality of planar sides of the 3D cooling structure; a second set of mountable power components that are mounted on a second planar side in the plurality of planar sides of the 3D cooling structure. The second planar side represents an opposing side, of the 3D cooling structure, to the first planar side. The 3D cooling structure includes an interior space containing one or more cooling channels in which cooling fluid is to flow. The interior space of the 3D cooling structure is spatially surrounded by other planar sides in the plurality of planar sides in combination with the first and second planar sides.