3D Chip Microfluidic Layers for Passive Heat Dissipation
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Solution Overview
Problem
Three-dimensional chips face overheating issues due to the stacking of two-dimensional integrated circuits, which can lead to thermal management challenges as heat dissipation becomes inefficient.
Innovation Solution
Incorporating microfluidic channel layers with working fluid flow paths that extend along and through the layers, utilizing passive heat transfer means such as heat pipes or oscillating heat pipes, to facilitate effective heat transfer from integrated circuit layers to a heat rejection surface, while also enabling electrical signal transfer through vias.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple integrated circuit layers are stacked to form a three-dimensional chip, then the chip density and integration are improved, but heat dissipation efficiency deteriorates leading to overheating issues
Solution Approach 1:
The patent divides the heat dissipation function into multiple microfluidic channel layers positioned between integrated circuit layers. Each microfluidic channel layer contains multiple microfluidic channels that segment the heat transfer path, allowing heat to be dissipated from multiple locations simultaneously rather than through a single heat sink, thereby resolving the overheating issue while maintaining high integration density
Solution Approach 2:
The patent introduces microfluidic channel layers as intermediary structures between integrated circuit layers. These intermediary layers contain working fluid that actively absorbs and transports heat away from the integrated circuits, serving as a thermal mediator that prevents heat accumulation while maintaining the compact stacked architecture
2Temperature
If microfluidic channel layers are added for heat transfer, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple functions into the microfluidic channel layers: heat transfer, electrical signal transfer through vias, and structural support between integrated circuit layers. By combining these functions into a single integrated component rather than adding separate systems, the patent improves heat dissipation while minimizing the increase in device complexity
Solution Approach 2:
The microfluidic channel layers are designed to perform multiple functions simultaneously: passive heat transfer through working fluid, electrical signal transmission through vias, and mechanical support between layers. This multi-functionality reduces the need for additional separate components, thereby improving heat dissipation efficiency without proportionally increasing device complexity
3Device complexity
If passive heat transfer means are used, then device complexity is reduced by eliminating external pumps, but heat transfer capability may be limited
Solution Approach 1:
The patent employs two-phase cooling systems where the working fluid undergoes phase transitions (evaporation and condensation) within the microfluidic channels. This phase change mechanism enables highly efficient heat transfer without requiring external pumps, as the phase transitions themselves drive the fluid circulation, thereby achieving both reduced device complexity and enhanced heat transfer capability
Solution Approach 2:
The patent utilizes oscillating heat pipes that change operational parameters dynamically, including flow direction and phase distribution, to enhance heat transfer capability. These parameter changes occur passively within the system without external control, maintaining simplicity while improving heat transfer efficiency through self-adjusting mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for efficient passive heat dissipation from the three-dimensional chip, reducing the risk of overheating and maintaining the compact footprint of the stacked design, while allowing for both heat and electrical signal transfer without the need for external pumps.
Implementation Method 1
the microfluidic channels are configured to enable working fluid to flow through the microfluidic channels to provide passive heat transfer means
Implementation Method 2
microfluidic channels are configured to enable heat transfer from the integrated chip layers, though the three-dimensional chip to the heat rejection surface
Implementation Method 3
The three-dimensional chip may comprise a heat rejection surface
Implementation Method 4
The passive heat transfer means may comprise an oscillating heat pipe
Implementation Method 5
The passive heat transfer mean may comprise a two-phase cooling system
Data Source
AI summary
Examples of the disclosure relate to a three-dimensional chip. The three-dimensional chip includes a plurality of integrated circuit layers and one or more microfluidic channel layers. The plurality of integrated circuit layers includes one or more electronic and/or photonic components and are arranged in a stack. The one or more microfluidic channel layers are positioned between integrated circuit layers. The microfluidic channel layers include microfluidic channels and the microfluidic channels are configured to enable working fluid to flow through the microfluidic channels to provide passive heat transfer for the one or more electronic and/or photonic components in the integrated circuit layers. The microfluidic channels include one or more portions that extend along a microfluidic channel layer and one or more portions that extend through a microfluidic channel layer.