3D Photonic-Electronic Chip Packaging for Optical Interface Protection
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Solution Overview
Problem
Current packaging methods for photonic and electronic chips face challenges in protecting the optical coupling interface and achieving strong packaging while minimizing warpage, leading to increased insertion loss and unsuitable performance for high IO applications.
Innovation Solution
A three-dimensional packaging method involving a photonic chip with an optical coupling interface, a dummy chip with a cavity, and an injection molding material layer that covers the electronic and dummy chips but not the optical interface, ensuring protection and stability through precise thinning and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If molding packaging is applied directly on the surface of the photonic chip to prevent warpage and enhance packaging strength, then the packaging strength and stability are improved, but the optical coupling interface is damaged, leading to increased insertion loss
Solution Approach 1:
The packaging structure is segmented into distinct regions: a first region with the optical coupling interface that remains exposed and unprotected by molding material, and a second region without the optical coupling interface that is covered by the molding packaging layer. This spatial segmentation allows the packaging to provide structural support and prevent warpage in the second region while preserving the optical coupling interface quality in the first region.
2Volume of stationary object
If three-dimensional packaging is used to minimize package size, then the package volume is reduced, but the optical coupling interface becomes vulnerable to damage and warpage occurs
Solution Approach 1:
The molding packaging layer is applied selectively with different coverage characteristics to different regions of the photonic chip. The first region containing the optical coupling interface is excluded from molding material coverage, while the second region is fully covered. This local differentiation in packaging quality allows compact three-dimensional packaging while protecting the critical optical interface from damage and warpage.
3Volume of stationary object
If the photonic chip is thinned to reduce package size, then the package volume is minimized, but warpage occurs causing misalignment or failure of connection points
Solution Approach 1:
The molding packaging layer is applied beforehand to the second region of the photonic chip to provide mechanical support and prevent warpage that would otherwise occur during or after the thinning process. This preventive packaging approach allows the chip to be thinned to minimize package volume while maintaining the alignment precision of connection points through the stabilizing effect of the molding material.
Data Source
AI summary
The present disclosure provides a three-dimensional packaging method and a three-dimensional package structure of a photonic-electronic chip. The method includes: fixing an electronic chip on a first area of a first surface of a photonic chip; fixing a dummy chip on a second area of the first surface of the photonic chip, wherein the photonic chip is provided with an optical coupling interface at the second area, and the dummy chip has a cavity with a single-sided opening, and the opening of the cavity faces and covers an optical coupling interface.