3D Chip Package Structure for Shorter Conductive Paths
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Solution Overview
Problem
The semiconductor industry faces challenges in forming reliable semiconductor devices at increasingly smaller sizes due to the complexity and difficulty of fabrication processes as feature sizes decrease, affecting production efficiency and costs.
Innovation Solution
A chip package structure is formed using a carrier substrate with multiple layers, including adhesive, dielectric, and wiring layers, and conductive pillars, which allows for efficient electrical connection and signal transmission between chips, reducing the conductive path and improving performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If feature sizes continue to decrease to increase functional density, then production efficiency is improved and costs are lowered, but fabrication processes become more difficult and reliability decreases
Solution Approach 1:
The patent transitions from planar 2D chip layouts to three-dimensional stacked architectures, adding a vertical dimension to device integration. This allows continued scaling and functional density improvement without proportionally increasing fabrication complexity, as the stacking approach separates certain fabrication steps and enables modular assembly of three-dimensional integrated circuits.
2Productivity
If feature sizes continue to decrease to increase functional density, then production efficiency is improved and costs are lowered, but fabrication processes become more difficult
Solution Approach 1:
The patent divides the integrated circuit into multiple separate chips or layers that can be fabricated independently using existing process nodes, then stacked and interconnected. This segmentation allows each layer to be manufactured using optimized, simpler processes rather than requiring the entire complex structure to be fabricated at the smallest feature size, thereby improving ease of manufacture while maintaining high functional density.
3Productivity
If functional density is increased by scaling down, then production efficiency improves, but the complexity of processing increases
Solution Approach 1:
By moving to three-dimensional stacking, the patent increases functional density through vertical integration rather than continuing to scale lateral dimensions. This dimensional transition reorganizes processing complexity across multiple fabrication stages and assembly steps, distributing the complexity rather than concentrating it in a single scaling process, thereby improving production efficiency while managing overall processing complexity.
Data Source
AI summary
A chip package structure is provided. The chip package structure includes a first redistribution structure having a first surface and a second surface opposite to the first surface. The chip package structure includes a first chip over the first surface. The chip package structure includes a first conductive bump connected between the first chip and the first redistribution structure. The chip package structure includes a first conductive pillar over the first surface and electrically connected to the first redistribution structure. The chip package structure includes a second chip over the second surface. The chip package structure includes a second conductive bump connected between the second chip and the first redistribution structure. The chip package structure includes a second conductive pillar over the second surface and electrically connected to the first redistribution structure.