3D Chip Stack with Power Generation Die for Autonomous IC Operation
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Solution Overview
Problem
Self-powered devices, particularly integrated circuits, rely on batteries that need frequent recharging or replacement, and tying these devices to batteries is not suitable for all applications due to battery limitations.
Innovation Solution
A stacked three-dimensional integrated circuit structure that includes a power generation die, a power storage and control die, and a functional system die, where the dies are fabricated using different technologies optimal for their components and interconnected via conductors and through-silicon vias to generate, store, and manage power autonomously without external power sources.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of moving object
If batteries are used to power self-powered devices, then power storage capacity can be increased, but the devices require periodic recharging or replacement
Solution Approach 1:
The integrated circuit is divided into multiple separately fabricated dies that are stacked together. Each die can be manufactured using different fabrication technologies optimized for its specific function (power generation, power storage, functional components), allowing independent optimization and resolution of the battery recharging limitation
Solution Approach 2:
The patent transitions from a two-dimensional planar integration to a three-dimensional stacked architecture. This vertical stacking enables multiple functional dies to be integrated in the third dimension, allowing power generation and power storage to be physically separated yet electrically connected, thereby eliminating the need for external battery recharging
2Reliability
If different fabrication technologies are used for different components, then component optimization is improved, but device complexity increases
Solution Approach 1:
The system is segmented into separate dies that can be fabricated using different technologies. Each die is optimized for its specific function using the most appropriate fabrication process, while the segmentation itself manages the complexity by allowing independent fabrication and subsequent stacking
Solution Approach 2:
Through-silicon vias (TSVs) serve as intermediary structures that enable electrical connection between the differently-fabricated dies. These TSVs act as the mediating interface that reconciles the complexity of multiple fabrication technologies by providing a standardized interconnection method
Data Source
AI summary
Structures and methods for self-powered devices are disclosed herein. Specifically, disclosed herein is a stacked, three-dimensional integrated circuit including a power generation die including a power source. The integrated circuit also includes a functional system die including one or more functional components that are powered by power generated by the power source. The power generation die and the functional system die are stacked in a three-dimensional structure.