3D Laminated Chip Layout for Thermal and I/O Reliability
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Solution Overview
Problem
Existing semiconductor packages face challenges in achieving high thermal characteristics and reliability while accommodating large-sized high-power logic chips, particularly when these chips are positioned on the upper portion of the package, leading to decreased thermal properties and increased wiring demands.
Innovation Solution
A 3D laminated chip structure is designed with a large-sized logic chip on the upper portion and smaller memory chips on the lower portions, supplemented by additional dummy chips and through electrodes to enhance thermal properties and reliability, ensuring sufficient wiring and power delivery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a large-sized high-power logic chip is positioned on the upper portion of the package, then the capacity and performance are increased, but the thermal characteristics deteriorate
Solution Approach 1:
The patent transitions from a conventional 2D planar arrangement to a 3D stacked architecture, placing the large logic chip on the upper layer and memory chips on lower layers. This vertical stacking enables high capacity while separating heat-generating components from the heat-sensitive package substrate, improving thermal characteristics through spatial dimensionality change.
Solution Approach 2:
The patent divides the semiconductor package into multiple functional layers: a large logic chip on the upper portion, smaller memory chips on lower portions, and dummy chips for thermal management. This segmentation allows each component to be optimized for its specific function while collectively solving the thermal-capacity contradiction.
2Power
If a large-sized logic chip is used, then the performance is increased, but the wiring complexity increases
Solution Approach 1:
The patent utilizes vertical stacking to reduce wiring complexity. By placing memory chips directly beneath the logic chip in a 3D configuration, the interconnect length is dramatically reduced compared to lateral routing on a single plane. Through-electrodes penetrate the logic chip to connect with lower layers, simplifying the overall wiring architecture while maintaining high performance.
3Temperature
If smaller memory chips are placed on lower portions, then the thermal properties are improved, but the I/O connections require additional routing
Solution Approach 1:
The patent segments the package into specialized zones: upper logic chip for computation, lower memory chips for storage, and dummy chips for thermal management. Each segment is optimized for its function, with through-electrodes providing direct vertical connections that minimize routing complexity despite the multi-layer configuration.
Solution Approach 2:
The patent introduces through-electrodes as intermediary connection elements that penetrate the logic chip to establish direct electrical connections with lower layers. These intermediaries simplify routing by providing dedicated vertical pathways, eliminating the need for complex lateral routing around the large logic chip.
4Reliability
If dummy chips are added to enhance thermal properties, then the reliability is increased, but the device complexity increases
Solution Approach 1:
The patent divides the package into functional segments including active logic chips, memory chips, and dummy chips. The dummy chips are strategically placed to provide thermal management without interfering with active functionality, improving reliability through dedicated thermal zones while maintaining clear structural segmentation.
Solution Approach 2:
The dummy chips serve multiple functions: they provide thermal management by acting as heat sinks, maintain mechanical stability of the stacked structure, and enable uniform heat distribution across the package. This multi-functionality justifies their inclusion despite increasing structural complexity, as they simultaneously address thermal, mechanical, and reliability concerns.
Data Source
AI summary
A three-dimensional (3D) laminated chip that includes a first semiconductor chip including a first through electrode disposed therein. A second semiconductor chip is arranged horizontally adjacent to the first semiconductor chip. A third semiconductor chip is arranged on the first semiconductor chip and the second semiconductor chip. A size of the third semiconductor chip is greater than a size of the first semiconductor chip.