3D Chip Heat Dissipation Structures for Vertical Thermal Routing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Three-dimensional system on integrated chip structures face high heat density and poor thermal dissipation, leading to electromigration, performance deterioration, and reliability issues due to temperature gradients and thermo-mechanical stress.
Innovation Solution
Implementing heat dissipation structures within and between chips, including lateral and vertical thermally conductive layers and structures, to efficiently route heat to designated areas or external heat sinks, using materials with high thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If three-dimensional system on integrated chip structures are used to increase chip density, then productivity is improved, but heat dissipation performance deteriorates
Solution Approach 1:
The patent introduces vertical heat dissipation pathways through thermally conductive structures extending between stacked chips, transitioning from traditional two-dimensional lateral heat dissipation to three-dimensional vertical heat management. This enables heat to be conducted in the vertical dimension between chips, resolving the thermal accumulation problem inherent in 3D stacking while maintaining high chip density.
Solution Approach 2:
The patent employs thermally conductive structures as intermediary elements between stacked chips to facilitate heat transfer. These structures act as thermal mediators, conducting heat from high-density chip regions to heat dissipation locations, thereby improving overall thermal management without compromising chip density or requiring fundamental changes to the 3D stacking architecture.
2Productivity
If three-dimensional system on integrated chip structures with increased chip density are implemented, then productivity is improved, but harmful factors increase due to high heat density
Solution Approach 1:
The patent converts the harmful effect of high heat density generated by increased chip density into a manageable thermal conduction problem. By introducing dedicated thermally conductive structures, the heat that would otherwise cause damage is redirected through controlled pathways to heat dissipation locations, transforming a harmful byproduct into a managed thermal flow that maintains system reliability.
Solution Approach 2:
The patent extracts heat from high-density chip regions by providing dedicated vertical heat dissipation pathways. The thermally conductive structures selectively remove heat from critical high-density areas and transport it to external heat sinks or lower-power regions, effectively separating the heat generation function from the computational function and preventing thermal damage.
3Reliability
If heat dissipation structures are added to 3D SoIC structures, then thermal dissipation performance is improved, but device complexity increases
Solution Approach 1:
The patent designs thermally conductive structures that can serve multiple functions within the 3D SoIC architecture. These structures not only conduct heat vertically between chips but can also provide mechanical support, electrical isolation, or structural alignment features. By making the heat dissipation components multi-functional, the patent improves thermal management without proportionally increasing device complexity.
Solution Approach 2:
The patent merges the heat dissipation function with existing structural elements of the 3D SoIC architecture. Rather than adding completely separate heat dissipation components, the thermally conductive structures are integrated into the inter-chip connection framework, combining thermal management with mechanical support and electrical interconnection functions, thereby minimizing the increase in overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation capabilities, reducing electromigration and thermo-mechanical stress, thereby improving the reliability and performance of 3D SoIC structures.
Implementation Method 1
Implementing heat dissipation structures within and between chips, including lateral and vertical thermally conductive layers and structures, to efficiently route heat to designated areas or external heat sinks
Data Source
AI summary
The present disclosure describes heat dissipation structures formed in functional or non-functional areas of a three-dimensional chip structure. These heat dissipation structures are configured to route the heat generated within the three-dimensional chip structure to designated areas on or outside the three-dimensional chip structure. For example, the three-dimensional chip structure can include a plurality of chips vertically stacked on a substrate, a first passivation layer interposed between a first chip and a second chip of the plurality of chips, and a heat dissipation layer embedded in the first passivation layer and configured to allow conductive structures to pass through.