3D Laminated Chip Layout for Thermal and Wiring Reliability
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Solution Overview
Problem
Existing semiconductor packages face challenges in achieving high thermal characteristics and reliability while accommodating large-sized high-power logic chips, particularly when these chips are positioned on the upper portion of the package, leading to decreased thermal properties and increased wiring demands.
Innovation Solution
A 3D laminated chip structure is designed with a large-sized logic chip on the upper portion and smaller memory chips on the lower portions, supplemented by additional dummy chips and through electrodes to enhance thermal properties and reliability, ensuring sufficient wiring and power delivery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a large-sized high-power logic chip is positioned on the upper portion of the package, then the capacity and performance are increased, but the thermal characteristics deteriorate
Solution Approach 1:
The patent transitions from a traditional planar chip arrangement to a three-dimensional laminated structure. Multiple chips are stacked vertically across different layers (first, second, and third semiconductor chips), enabling heat dissipation in the vertical dimension while maintaining high capacity through increased chip quantity and integration density.
Solution Approach 2:
The large logic chip is segmented into multiple smaller chip units (first, second, and third semiconductor chips) that are laminated in a 3D structure. This segmentation reduces the thermal load on any single chip while collectively providing the required high capacity, and allows for better heat distribution and management across the package.
2Reliability
If a large-sized logic chip is used, then the performance is improved, but the wiring complexity increases
Solution Approach 1:
The patent utilizes vertical stacking to reduce horizontal wiring complexity. By arranging chips in multiple layers (first, second, and third semiconductor chips stacked vertically), the interconnections are routed through vertical vias and TSVs rather than extensive planar traces, significantly reducing wiring complexity while maintaining high performance through short inter-chip paths.
Solution Approach 2:
The patent introduces intermediate connection structures including TSVs (through-silicon vias), bonding pads, and interlayer dielectric layers that mediate the connections between stacked chips. These intermediaries simplify the wiring architecture by providing standardized vertical interconnection pathways, reducing the complexity of direct chip-to-chip routing.
3Volume of moving object
If miniaturization is pursued, then the device size is reduced, but the thermal management becomes more difficult
Solution Approach 1:
The patent achieves miniaturization through 3D vertical stacking of multiple semiconductor chips, dramatically reducing the horizontal footprint of the package. Thermal management is addressed by designing the vertical stack to facilitate heat flow from lower to upper layers, with heat dissipation surfaces distributed across multiple levels, enabling effective thermal management in a compact volume.
Solution Approach 2:
The package is segmented into multiple discrete chip layers (first, second, and third semiconductor chips) with intermediate bonding layers. This segmentation allows for distributed heat generation and heat dissipation paths, preventing heat concentration in a single location and enabling more effective thermal management in the miniaturized package structure.
Data Source
AI summary
A three-dimensional (3D) laminated chip that includes a first semiconductor chip including a first through electrode disposed therein. A second semiconductor chip is arranged horizontally adjacent to the first semiconductor chip. A third semiconductor chip is arranged on the first semiconductor chip and the second semiconductor chip. A size of the third semiconductor chip is greater than a size of the first semiconductor chip.