3D Circuit Board Impedance Control via Deepened Carrier Body
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Solution Overview
Problem
Conventional two-dimensional printed circuit boards (2D-PCBs) face challenges in controlling characteristic impedance and cross-talk, especially at high data rates, due to their limited design which restricts their performance in high-speed applications.
Innovation Solution
A three-dimensional circuit board design featuring a carrier body with circuit paths in multiple planes, an electrical grounding layer, and staggered mechanical and electrical termination portions to improve impedance and cross-talk control, incorporating a mechanical and electrical plug portion with a bevelled edge and guiding walls for enhanced alignment and contact management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional two-dimensional printed circuit board (2D-PCB) is used, then the device structure is simple and easy to manufacture, but the control of characteristic impedance and cross-talk compensation is complicated and limited
Solution Approach 1:
The patent transitions from a two-dimensional PCB layout to a three-dimensional circuit board structure with multiple planes (upper and lower planes at different height levels). Circuit paths can be arranged in different planes, allowing vertical separation of signal and ground paths while maintaining controlled impedance through the multi-plane configuration.
2Reliability
If circuit paths are arranged in multiple planes in a three-dimensional carrier body, then impedance control and cross-talk compensation are improved, but the device complexity increases
Solution Approach 1:
The circuit board is segmented into multiple distinct planes (upper and lower planes) at different height levels within the carrier body. Each plane can independently carry circuit paths, allowing separation of signal and ground paths in the vertical dimension to reduce cross-talk while maintaining manageable structural complexity through modular plane design.
3Reliability
If mechanical and electrical termination portions are staggered, then cross-talk is reduced and cable connection is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The mechanical termination portion and electrical termination portion are intentionally staggered (asymmetrically positioned) relative to each other along the longitudinal axis of the carrier body. This asymmetric arrangement reduces cross-talk between adjacent cables while improving cable connection geometry, with the staggered design built into the molded structure to manage precision requirements.
Data Source
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AI summary
The invention relates to a three-dimensional circuit board (1), comprising a carrier component (10; 30), carrying at least one circuit path (110, 120) at an outside of a carrier body (100; 300) of the carrier component (10; 30), wherein, for impedance control, the carrier body (100; 300) comprises a deepening (102), wherein the circuit path (110, 120) is at least partially arranged in the deepening (102).