3D Circuit Board Structure for Higher Pin Density
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Solution Overview
Problem
The number of lead-out pins of a function module is limited in existing two-dimensional circuit board structures due to fewer connecting pins between the function module board and the bottom board, restricting layout area and circuit wiring density.
Innovation Solution
A three-dimensional wired circuit board structure is designed with a bottom board, function board, and bridge board, where the function board is inserted into a slot on the bridge board and connected via pins, forming a combined module that is then inserted into a slot on the bottom board, with additional protrusions and slots for fixation and welding, allowing increased pin connections and space utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a two-dimensional circuit board structure is used, then the structure is simple, but the number of connecting pins is limited
Solution Approach 1:
The patent transitions from a two-dimensional circuit board structure to a three-dimensional structure by adding a vertical dimension. The function board is inserted vertically into the bottom board through slots, creating a multi-layer configuration that increases the number of connecting pins without significantly increasing overall structural complexity.
2Adaptability or versatility
If more function modules are added, then functionality increases, but the layout area is limited
Solution Approach 1:
By introducing a vertical insertion dimension, the patent allows multiple function modules to be stacked or arranged in three-dimensional space rather than being constrained to a two-dimensional plane. This enables increased functionality within the same footprint area.
Solution Approach 2:
The function board is inserted into the bottom board through slots, creating a nested configuration where one board is partially contained within the structure of another. This nesting approach maximizes space utilization and allows compact arrangement of multiple functional modules.
3Quantity of substance
If the number of connecting pins is increased, then more function modules can be connected, but the structure becomes more complex
Solution Approach 1:
The patent divides the circuit board system into separate functional modules (bottom board and function board) that can be independently designed and manufactured. Each board has its own pin arrangements, allowing the connecting pins to be segmented across multiple interfaces rather than requiring a single complex connection structure.
Data Source
AI summary
The present disclosure is a three-dimensional wired circuit board structure, including a bottom board, the bottom board having a first slot and a first pin thereon; a function board, the function board having a second pin and a third pin thereon; and a bridge board, the bridge board having a second slot and a fourth pin thereon. The bottom of the function board is inserted into the second slot and the second pin is connected to the fourth pin, so as to form a combined function module. The combined function module is inserted into the first slot, and the third pin is connected to the first pin.