3D Printed Circuit Wiring Heating to Prevent Swelling and Cracking

The patent applies parameter changes by carefully controlling the heating temperature and heating speed during the firing process. By optimizing these thermal parameters, the metal ink is successfully fired to form conductive circuit wiring while the insulating layer's thermal expansion is kept within acceptable limits, preventing swelling and cracking of the circuit wiring.

The patent directly addresses thermal expansion by selecting an insulating layer material with appropriate thermal expansion characteristics. The material is chosen so that its linear expansion coefficient produces expansion within a specific range when heated to the firing temperature, ensuring that the circuit wiring formed on top does not suffer from swelling or cracking while still allowing successful formation of the wiring.

The patent optimizes the heating temperature parameter to achieve the right balance between productivity and quality. By conducting experiments and simulations, the patent determines the optimal heating temperature range that allows the metal ink to be cured efficiently while keeping the insulating layer's thermal expansion within acceptable limits, thus preventing circuit wiring defects.

The patent applies partial action by using a heating temperature that is sufficient to cure the metal ink but not excessively high. This controlled approach ensures that the thermal energy provided is just enough to achieve the desired curing effect without causing excessive thermal expansion of the insulating layer that would lead to circuit wiring swelling or cracking.