3D Coaxial Microstructure Combiner Divider Networks
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Solution Overview
Problem
There is a need for lightweight, reliable, and efficient microwave signal processing components, particularly high power amplifiers, in small modular packages for applications like satellite communications that can handle electromagnetic signals effectively.
Innovation Solution
The development of three-dimensional coaxial microstructure combiners/dividers networks with n-way configurations, including 1:2, 1:4, and 1:6 configurations, utilizing three-dimensional coaxial microstructures with resistive elements and impedance matching structures to efficiently split and combine electromagnetic signals while minimizing loss and maximizing power handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If traditional planar microstructure combiners/dividers are used, then manufacturing is simpler, but power handling capability and shielding effectiveness are insufficient
Solution Approach 1:
The patent transitions from planar two-dimensional microstructure combiners/dividers to three-dimensional microstructure combiners/dividers. This dimensional change enables superior shielding effectiveness and higher power handling capability by allowing electromagnetic signals to be confined within three-dimensional coaxial structures, while the modular fabrication process keeps manufacturing complexity manageable through sequential layer construction.
2Power
If larger physical size is used, then power handling capability increases, but electrical size and loss increase
Solution Approach 1:
The patent employs impedance matching structures with optimized geometric parameters (widths, lengths, spacing) to minimize signal loss while maintaining high power handling capability. The three-dimensional coaxial microstructure design allows for controlled impedance transitions that reduce reflections and dissipative losses, enabling efficient power combining/splitting without requiring excessively large physical dimensions.
3Reliability
If three-dimensional microstructures are used, then shielding effectiveness and power handling improve, but fabrication complexity increases
Solution Approach 1:
The three-dimensional microstructure combiner/divider is fabricated using a segmented, modular approach where the structure is divided into multiple layers that can be independently patterned and assembled. This segmentation enables the complex three-dimensional shielding structure to be built through sequential fabrication steps, making the manufacturing process more manageable while maintaining superior shielding effectiveness.
4Adaptability or versatility
If n-way configurations are implemented, then signal processing versatility increases, but device complexity increases
Solution Approach 1:
The three-dimensional microstructure combiner/divider design provides universal functionality that can operate as both a power combiner and a power divider, and can be configured for various n-way splitting/combining ratios (1:2, 1:4, 1:8, etc.). This multi-functionality is achieved through a unified three-dimensional coaxial structure that can be adaptively connected to different signal sources and loads, reducing the need for separate dedicated components for each function.
Data Source
AI summary
An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.