3D Coil Inductor Module With Magnetic Encapsulation for Chip Area Reduction
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Solution Overview
Problem
Conventional inductor devices occupy too much surface area on semiconductor chips, hindering the development of smaller, lighter, and thinner semiconductor packages, and lack effective electromagnetic shielding.
Innovation Solution
A semiconductor device is designed with a three-dimensional coil inductor formed by a top routing layer, conductive pillars, and an encapsulation layer with a magnetic material, which includes a conductor structure and encapsulation layer to generate magnetic flux, reducing surface area occupation and providing shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a conventional inductor device is used, then the inductor can be electrically connected to the semiconductor chip, but it occupies too much surface area of the semiconductor chip
Solution Approach 1:
The patent transitions from a planar inductor design to a three-dimensional inductor structure by stacking multiple conductive layers (first conductive layer, second conductive layer) with insulating layers in between, creating vertical loops that generate magnetic flux while occupying minimal chip surface area
Solution Approach 2:
The patent employs composite material structures combining conductive materials (copper or aluminum) for the conductive layers, insulating materials (silicon dioxide or silicon nitride) for the insulating layers, and magnetic shielding materials (mu-metal or permalloy) for the shielding function, integrating multiple material properties into a single compact inductor module
2Area of stationary object
If the inductor device size is reduced, then the semiconductor package size can be minimized, but electromagnetic shielding protection is lost
Solution Approach 1:
The patent embeds the magnetic shielding layer within the multi-layer inductor structure, placing it between the first and second conductive layers, so that the shielding function is integrated into the inductor itself rather than requiring separate external shielding structures
Solution Approach 2:
The patent implements electromagnetic shielding in the vertical dimension by stacking conductive and insulating layers to form three-dimensional loops, allowing the inductor to achieve both size reduction and shielding protection through vertical space utilization rather than horizontal expansion
3Area of stationary object
If a three-dimensional coil inductor is formed, then surface area occupation is reduced and magnetic flux is enhanced, but the device complexity increases
Solution Approach 1:
The patent divides the inductor into discrete segmented layers (first conductive layer, first insulating layer, second conductive layer, second insulating layer) that can be independently formed and controlled, simplifying the manufacturing process while achieving the three-dimensional structure
Solution Approach 2:
The patent uses standard semiconductor fabrication processes (physical vapor deposition, chemical vapor deposition, sputtering, etching) that are already universally employed in chip manufacturing, allowing the complex three-dimensional inductor structure to be created using existing multi-functional fabrication equipment and techniques
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The three-dimensional coil inductor design reduces the size of the semiconductor device while enhancing magnetic flux and offering electromagnetic shielding, meeting the requirements of miniaturization and performance.
Implementation Method 1
the conductor structure and the encapsulation layer confined by the conductor structure constitute an inductor module
Implementation Method 2
providing shielding
Data Source
AI summary
A semiconductor device and a manufacturing method thereof are provided, which mainly form a first wiring layer, a bottom routing layer, and a plurality of conductive pillars on a carrier structure, and the plurality of conductive pillars are electrically connected to the first wiring layer and the bottom routing layer. Next, an encapsulation layer covering the plurality of conductive pillars is formed on the first wiring layer and the bottom routing layer, wherein the encapsulation layer includes a magnetic material. Then, a top routing layer and a second wiring layer are formed on the encapsulation layer, and the plurality of conductive pillars are electrically connected to the top routing layer and the second wiring layer, wherein the bottom routing layer, the plurality of conductive pillars, and the top routing layer constitute a conductor structure, and the conductor structure and the encapsulation layer confined thereby constitute an inductor module.