3D Coil Inductor with Embedded Magnetic Layer
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Solution Overview
Problem
The miniaturization of electronic devices has increased the demand for more efficient and compact inductors, but existing inductor designs face challenges in achieving optimal electrical, thermal, and mechanical stability, particularly in maintaining high inductance properties and reducing DC resistance.
Innovation Solution
The design incorporates a core insulating layer with a through via and multiple coil patterns, where the second coil pattern is formed with a smaller diameter on the lower surface than the upper surface to reduce misalignment defects, and a magnetic material layer is embedded within the insulating layer to enhance inductance properties, along with an external electrode for electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the coil area is increased to improve inductance properties, then the inductance increases, but the device size increases
Solution Approach 1:
The patent utilizes three-dimensional space by forming coil patterns on both the upper and lower surfaces of the core insulating layer, connected through via holes. This vertical stacking approach increases the effective coil area and inductance without expanding the planar footprint of the device, effectively transitioning from two-dimensional to three-dimensional coil configuration.
Solution Approach 2:
The patent embeds multiple coil patterns within each other in the vertical dimension, with the first coil pattern on the upper surface, via holes penetrating through, and the second coil pattern on the lower surface. This nested arrangement maximizes the use of available space, allowing larger coil area and higher inductance within a compact form factor.
2Reliability
If the through via diameter is increased to improve electrical connection, then the connection quality improves, but the misalignment defect increases
Solution Approach 1:
The patent employs an asymmetric via hole structure where the via holes are positioned offset from the center of the coil patterns, specifically located between the first and second coil patterns. This asymmetric arrangement reduces the risk of misalignment during manufacturing while maintaining effective electrical connection between the upper and lower coil patterns.
Solution Approach 2:
The via holes act as intermediary connection elements that bridge the upper and lower coil patterns without requiring direct alignment between them. By positioning the via holes in the space between the coil patterns rather than requiring precise overlap, the design tolerates manufacturing variations and reduces misalignment defects.
3Reliability
If multiple coil patterns are stacked to increase inductance, then the inductance properties improve, but the manufacturing complexity increases
Solution Approach 1:
The patent divides the coil structure into segmented parts: a first coil pattern on the upper surface, via holes penetrating through the core insulating layer, and a second coil pattern on the lower surface. This segmentation allows each component to be manufactured and optimized independently, then assembled into the complete inductor structure, managing complexity through modular design.
Solution Approach 2:
The core insulating layer serves multiple functions simultaneously: it provides electrical insulation between the upper and lower coil patterns, serves as the structural substrate for mounting the coil patterns, and contains the via holes for electrical connection. This multi-functionality reduces the number of separate components needed, simplifying the overall manufacturing process.
Data Source
AI summary
Disclosed is an inductor and a method of manufacturing the same. The inductor may include a core insulating layer, a coil including at least one coil pattern formed on an upper part of the core insulating layer, at least one coil pattern formed on a lower part of the core insulating layer, and a through via configured to electrically connect the at least one coil pattern on the upper part and the lower part, and an insulating layer formed on the upper part and the lower part of the core insulating layer, the insulating layer embedding the coil.