3D Complementary-Conducting-Strip Structure for High-Density ICs
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Solution Overview
Problem
Current technologies for high-density integrated circuits, such as monolithic microwave integrated circuits, face challenges in saving wafer area, reducing interference, enhancing heat dissipation, and increasing design flexibility, particularly in high-frequency applications like microwave and millimeter-wave communication.
Innovation Solution
A three-dimensional complementary-conducting-strip structure is developed, where two-dimensional mesh metal layers are vertically stacked and connected through vias to form a three-dimensional network, allowing signal lines to trace arbitrarily within unit cells, providing enhanced flexibility, screening, and heat dissipation, while minimizing area occupation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If two-dimensional mesh metal layers are vertically stacked to form three-dimensional network structure, then design flexibility and heat dissipation are improved, but device complexity increases
Solution Approach 1:
The patent transitions from conventional two-dimensional planar metal layers to three-dimensional vertically stacked mesh metal layers. This dimensional change allows signal lines to be routed in multiple directions (horizontal and vertical) and enables better heat dissipation through increased surface area, while the modular mesh structure maintains fabrication feasibility through standardized via connections between layers.
2Area of stationary object
If signal lines trace three-dimensionally inside unit cells, then area occupation is reduced and density is increased, but manufacturing precision requirements increase
Solution Approach 1:
The patent divides the substrate into discrete unit cells with standardized dimensions and via patterns. Each unit cell contains predefined via locations that serve as registration marks, enabling precise alignment of stacked metal layers through modular assembly. This segmentation approach reduces the overall substrate area while maintaining manufacturing feasibility through repeated standardized patterns.
3Object-affected harmful factors
If two-dimensional mesh vias are used to connect metal layers, then interference between signal lines is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent employs mesh-like two-dimensional vias with periodic open patterns instead of solid filled vias. This porous structure provides electromagnetic shielding and reduces signal interference between adjacent signal lines while maintaining via conductivity. The periodic mesh pattern is fabrication-friendly as it can be formed using standard photolithography and etching processes, avoiding the need for complex filled-via techniques.
Data Source
AI summary
The invention discloses a three-dimensional complementary-conducting-strip (CCS) structure. Some two-dimensional mesh metal layers are stacked vertically and connected mutually via numerous vias to form a three-dimensional network structure, and one or more signal lines with three-dimensional trace style(s) are positioned inside and separated away the three-dimensional network structure. Moreover, each two-dimensional mesh metal layer is a planar metal layer with one or more empty areas. The three-dimensional network structure is grounded, the signal lines(s) is electrically connected to the device(s) and/or terminal(s) respectively, and the dielectric material(s) is used to electrically insulate the signal line(s) from the three-dimensional network structure.