3D Conducting Structure via Segmented TSV and Insulator
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Solution Overview
Problem
Conventional three-dimensional package technologies face issues with mal-alignment and current leakage due to unstable laser drilling and insufficient material differentiation during through silicon via (TSV) fabrication, leading to increased costs and inefficiencies.
Innovation Solution
A three-dimensional conducting structure comprising a substrate with a through hole, a first redistributed conductor with a projecting and receiving portion, and an insulator, where the second redistributed conductor is positioned within the through hole and recess, filled with conductive material to avoid direct contact with the substrate and prevent current leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser drilling is used to form through silicon via, then via formation is achieved, but hole enlargement and current leakage occur due to unstable laser drilling and insufficient material differentiation
Solution Approach 1:
The conducting structure is divided into multiple segments: a first conducting structure extending from the pad surface, a second conducting structure within the via, and an insulator filling the space between them. This segmentation prevents direct contact between conductive materials and eliminates current leakage paths while maintaining via formation capability.
Solution Approach 2:
An insulator material is introduced as an intermediary between the first and second conducting structures. This intermediary prevents direct electrical contact between the conducting structures and the substrate, eliminating current leakage while allowing the via to maintain its structural integrity and electrical connection function.
2Productivity
If conventional TSV fabrication is used, then interconnection is achieved, but package volume increases and wire length increases reducing efficiency
Solution Approach 1:
The conducting structures extend in multiple dimensions: the first conducting structure extends horizontally from the pad surface, while the second conducting structure extends vertically within the via. This multi-dimensional arrangement optimizes space utilization, reduces package volume, and shortens effective wire length while maintaining efficient interconnection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This structure reduces package volume, shortens wire length, enhances transmission speed, and prevents current leakage, improving overall efficiency and reliability.
Implementation Method 1
a first laser drilling process is applied by way of drilling a opening 14 from the back surface 10b of the chip until reaching the surface of the pad 12
Data Source
AI summary
The three-dimensional conducting structure comprises a substrate, a first redistributed conductor, a second redistributed conductor and an insulator. The substrate has an active surface, a passive surface opposite to the active one, a pad on the active surface and a through hole. The first redistributed conductor comprises a projecting portion and a receiving portion. The projecting portion is projected from the active surface and electrically connected to the pad. The receiving portion is outside the active surface and in contact with the projecting portion, both of which constitute a recess communicating with the through hole. The second redistributed conductor is positioned within the through hole and the recess, in contact with the receiving portion, and extended toward the passive surface along the through hole. The insulator is filled between the second redistributed conductor and the substrate and between the second redistributed conductor and the projecting portion.