3D Conductive Structures With Low Topography on Plastic Substrates
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Solution Overview
Problem
Existing methods struggle to produce electrically conductive structures on plastic substrates with high ampacity, low surface roughness, and resistance to mechanical stress, particularly in applications with large curvatures like vehicle steering wheels, where conventional materials and methods result in noticeable protrusions and reduced conductivity.
Innovation Solution
A method involving atmospheric plasma spray process to deposit electrically conductive material on a plastic substrate, using a masking material with controlled adherence, followed by cleaning to form structured members with low topographic variation and high conductivity, achieved through a porous, sponge-like structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional materials and methods are used to produce electrically conductive structures on plastic substrates, then the structures can be manufactured, but they exhibit high surface roughness and noticeable protrusions that reduce aesthetic quality and may interfere with high-frequency applications
Solution Approach 1:
The patent applies atmospheric plasma spray deposition to deposit electrically conductive material onto a plastic substrate. This parameter change in the deposition process enables precise control over the thickness and surface quality of the conductive layer, achieving low surface roughness (Ra < 1.6 μm) while maintaining high electrical conductivity (40-80% of bulk copper). The plasma spray process allows for optimized deposition parameters that simultaneously improve surface finish and electrical properties.
Solution Approach 2:
The patent creates a composite structure by depositing electrically conductive material (such as copper or copper alloys) onto a plastic substrate through atmospheric plasma spray. This composite material approach combines the electrical conductivity of metal with the flexibility and corrosion resistance of plastic, achieving both high electrical conductivity and low surface roughness in a single integrated layer.
2Reliability
If conventional conductive materials are used, then electrical conductivity can be achieved, but the structures lack flexibility and are prone to cracks and fissures under mechanical stress, particularly on curved surfaces
Solution Approach 1:
The patent employs a thin film approach by depositing a thin layer of electrically conductive material (1-20 μm thickness) directly onto the plastic substrate using atmospheric plasma spray. This thin film structure inherently follows the contours of the substrate, including curved surfaces, and maintains flexibility without forming cracks or fissures under mechanical stress, unlike conventional rigid conductive materials.
Solution Approach 2:
The patent optimizes the deposition parameters of the atmospheric plasma spray process to control the microstructure of the deposited conductive layer. By adjusting parameters such as plasma power, deposition rate, and material feed rate, the process creates a ductile, crack-resistant microstructure that maintains mechanical strength and flexibility under stress while preserving electrical conductivity.
3Reliability
If the conductive structures are arranged close to the top decor surface to enable optimal performance, then performance is improved, but the topographic variation increases making the structures more noticeable to users
Solution Approach 1:
The patent controls the deposition thickness and surface profile parameters of the atmospheric plasma spray process to achieve optimal performance with minimal topographic variation. By precisely controlling the deposited layer thickness (1-20 μm) and surface roughness (Ra < 1.6 μm), the conductive structures can be positioned close to the top decor surface for optimal capacitive sensing or heating performance while remaining visually imperceptible.
4Power
If high ampacity is required for the conductive structures, then electrical performance is improved, but the surface roughness and topographic variation increase
Solution Approach 1:
The patent uses electrically conductive materials with high intrinsic conductivity (such as copper or copper alloys) deposited through atmospheric plasma spray. This composite approach allows the thin deposited layer to achieve high ampacity due to the high conductivity of the material itself, while the plasma spray process simultaneously controls surface roughness to maintain aesthetic quality and prevent interference with high-frequency applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method produces assemblies with 40-80% of bulk copper conductivity, low surface roughness, and flexibility, making them unnoticeable and suitable for high-frequency applications, while reducing the risk of cracks and fissures under mechanical stress.
Implementation Method 1
applying an atmospheric plasma spray process to cover the track or the tracks and at least a portion of the masking material adjacent to each respective track with the electrically conductive material
Data Source
AI summary
A method of producing an assembly of structured members comprises: providing a flat substrate from plastic material; printing on the substrate tracks of a first thickness and corresponding to an intended course of the structured members from a material with strong adherence (AD1, AD2) to both the plastic material substrate and the electrically conductive material; printing a masking material with the first thickness directly on the surface, the masking material having an adherence (AD4) to the plastic material substrate that is larger than an adherence (AD3) to the electrically conductive material, wherein AD1 is larger than AD3; applying an atmospheric plasma spray process to cover each of the tracks and a portion of the masking material adjacent each respective track with the electrically conductive material; and applying a cleaning process to remove the electrically conductive material from at least the portion of the masking material adjacent to each respective track.