3D Conductor Layout in Resin-Sealed Power Packages
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Solution Overview
Problem
The existing electrical apparatuses face challenges in miniaturization due to the larger physical size of the sealing resin, which is often required to maintain the shortest separation distance between terminal parts, leading to increased overall dimensions.
Innovation Solution
The electrical apparatus incorporates conductors with covering and exposing portions, where the covering resin covers the semiconductor element and conductors, aligning them in different directions to achieve a shorter separation distance between covering portions, thereby reducing the size of the covering resin and miniaturizing the apparatus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the sealing resin is used to maintain the separation distance between terminal parts, then the insulation and protection are ensured, but the physical size of the sealing resin increases, leading to larger overall dimensions of the electrical apparatus
Solution Approach 1:
The patent changes the arrangement dimension of conductors from a single-plane configuration to a three-dimensional spatial arrangement. Conductors are positioned at different heights (first height and second height) and aligned in different directions (first direction and second direction), allowing the covering resin to achieve effective insulation with reduced volume by utilizing vertical and horizontal spacing simultaneously.
Solution Approach 2:
The patent implements a nested structure where conductors are arranged in layers at different heights within the covering resin. The first conductor and second conductor are positioned at different vertical levels and aligned in different directions, creating a compact nested configuration that reduces the overall volume of the covering resin while maintaining insulation distances.
2Volume of stationary object
If conductors are aligned in different directions with covering and exposing portions, then the separation distance between covering portions is reduced, but the configuration complexity increases
Solution Approach 1:
The patent segments each conductor into distinct functional portions: covering portions (covered by resin) and exposing portions (exposed for connection). This segmentation allows conductors to be arranged in different directions and at different heights, reducing the volume of covering resin needed while maintaining clear identification of functional areas and simplifying the overall configuration.
Solution Approach 2:
The patent applies different spatial configurations to different portions of conductors based on their functional requirements. Covering portions are positioned to minimize resin volume, while exposing portions are strategically located for electrical connections. This local optimization of spatial arrangement reduces overall device complexity while achieving volume reduction.
Data Source
AI summary
An electrical apparatus includes a semiconductor element, conductors and a covering resin. The conductors are connected to the semiconductor element. At least one of the conductors extends in a first direction. The covering resin covers the semiconductor element and a portion of each of the conductors. The conductors respectively include covering portions and exposing portions. Each of the covering portions is covered by the covering resin. Each of the exposing portions is exposed from the covering resin. The conductors are aligned in a second direction. Two of the exposing portions closest to each other are spaced apart in each of the second direction and a third direction. The third direction is perpendicular to the first direction and the second direction. A shortest separation distance between two closest covering portions is shorter than a shortest separation distance between two closest exposing portions.