3D Copper Pillar Package Structure to Prevent Warping
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Solution Overview
Problem
Semiconductor packaging faces challenges in reducing package size and improving functional integration due to warping and delamination issues caused by diverse interlayer materials with different thermal expansion coefficients, which complicates the packaging process and reduces reliability.
Innovation Solution
A package-then-etch three-dimensional package structure electrically connected by plated copper pillars, where a metal carrier is preplated with a copper layer, and subsequent layers are formed through electroplating, with the metal carrier reserved in the process to prevent warping and enhance reliability, allowing for embedded components and improved functional integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If diverse interlayer materials are used for functional integration, then functional integration level is improved, but warping and delamination occur due to different thermal expansion coefficients
Solution Approach 1:
The patent uses a metal carrier with uniform material properties throughout its structure, replacing the traditional multi-material substrate stack. This homogeneous metal carrier eliminates the thermal expansion coefficient mismatches between different interlayer materials, preventing warping and delamination while providing a stable platform for functional integration.
Solution Approach 2:
The patent employs a composite structure consisting of a metal carrier combined with molding compound and embedded components. The metal carrier serves as the base substrate with superior mechanical stability, while the molding compound provides encapsulation and additional functional integration capabilities, creating a composite system that achieves both stability and versatility.
2Volume of moving object
If package size is reduced, then space efficiency is improved, but functional integration becomes more difficult due to limited space
Solution Approach 1:
The patent transitions from planar two-dimensional packaging to three-dimensional packaging by embedding components vertically within the molding compound on the metal carrier. This vertical stacking approach allows multiple functional components to be integrated in the thickness direction, achieving high functional integration within a compact footprint and effectively reducing overall package size.
Solution Approach 2:
The patent implements nested packaging by embedding passive components, active devices, and interconnect structures within the molding compound in a hierarchical arrangement. Smaller components are nested within or between larger structural elements, maximizing space utilization and enabling functional integration without increasing package footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables improved functional integration, reduced space usage, lower costs, and enhanced packaging reliability by preventing oxidation and warping, thus improving the overall packaging process and product stability.
Implementation Method 1
step 2, preplating a surface of the metal carrier with a copper layer
Implementation Method 2
forming the outer metal pin on the front side of the metal carrier by means of electroplating
Implementation Method 3
forming the metal circuit layer on the surface of the molding compound in step 4 by means of chemical plating or electroplating
Implementation Method 4
forming the metal circuit layer on the surface of the molding compound in step 4 by means of chemical plating or electroplating
Implementation Method 5
forming the conductive metal pillar on a surface of the metal circuit layer by means of electroplating
Implementation Method 6
forming the anti-oxidant metal layer on the exposed back side of the outer metal pin by means of electroplating
Data Source
AI summary
The present invention relates to a process of a package-then-etch three-dimensional package structure electrically connected by plated copper pillars. The process comprises the following steps: taking a metal carrier; preplating a surface of the metal carrier with a copper layer; forming an outer metal pin by means of electroplating; performing plastic packaging with epoxy resin; forming a metal circuit layer by means of electroplating; forming a conductive metal pillar by means of electroplating; surface-mounting a chip; performing plastic packaging; surface-mounting a passive device; performing plastic packaging; etching and windowing the carrier; forming an anti-oxidant metal layer by means of electroplating; and performing cutting to obtain a finished product. The integration level and the reliability can be improved.