3D Signal Coupler Layout for Low-Loss High-Directivity Coupling

The patent transitions from planar transmission line coupling to three-dimensional vertical coupling by stacking multiple conductor layers (first, second, and third conductor layers) at different heights. The coupled transmission line extends vertically through multiple layers with conductor portions arranged at different positions in the vertical direction, enabling compact coupling without requiring long horizontal transmission lines.

The patent embeds multiple conductor portions within a stacked configuration where the first, second, and third conductor layers are nested vertically. The coupled transmission line is formed by conductor portions in different layers that are galvanically connected, creating a compact nested structure that achieves coupling functionality in a reduced spatial footprint.

The patent achieves adequate coupling strength with short transmission lines by utilizing vertical separation between conductor layers. The coupled transmission line employs conductor portions at different vertical positions (first, second, and third conductor layers) that provide electromagnetic coupling without requiring long horizontal paths, thereby maintaining compact size while ensuring sufficient coupling directivity.

The patent optimizes coupling by strategically positioning conductor portions at specific vertical locations within the stacked layers. The first, second, and third conductor layers are arranged with specific spacing and overlap configurations to maximize electromagnetic interaction locally, enabling effective coupling with minimal transmission line length.

The patent divides the transmission line into multiple discrete conductor portions arranged in separate layers (first, second, and third conductor layers). Each conductor portion can be independently formed and positioned, allowing modular manufacturing processes such as separate deposition and patterning steps for each layer, which simplifies the fabrication of complex multi-layer structures.

The stacked conductor layers serve multiple functions: they provide electromagnetic coupling between the main and coupled transmission lines, enable galvanic connections through vertical stacking, and allow independent optimization of each layer's geometry. This multi-functional design reduces the need for additional specialized components or structures.