3D Cuboid Modules for Circuit Board Space
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Solution Overview
Problem
As the number of electronic components integrated into devices increases, the useable space on fixed-size circuit boards decreases, leading to a drawback in the design and usability of mobile electronic devices due to increased depth when using stacked circuit boards.
Innovation Solution
The implementation of three-dimensional cuboid modules with multiple surfaces embedded with circuit traces to interconnect electronic components, allowing for increased useable space on circuit boards while maintaining a fixed depth, through the use of stacked layers of printed circuit board material and internal vias for communication between surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple planar circuit boards are stacked to increase useable space, then the available surfaces for mounting components increase, but the overall stack height increases
Solution Approach 1:
The patent transitions from traditional planar two-dimensional circuit board layouts to a three-dimensional modular architecture where cuboid modules can be arranged in various configurations. This dimensional change allows components to be mounted on multiple surfaces (top, bottom, and side surfaces) of the modules, effectively increasing the useable space without proportionally increasing the overall device height, as modules can be interconnected through vertical and lateral connections.
2Adaptability or versatility
If the number of electronic components integrated into devices increases, then overall functionality increases, but the useable space on fixed-size circuit boards decreases
Solution Approach 1:
The patent divides the circuit board into modular cuboid units, each capable of being independently designed and populated with electronic components. These modules can be segmented further into smaller functional units that can be arranged in various configurations. This segmentation allows the system to accommodate increasing numbers of components by adding more modules rather than overloading a single fixed circuit board, thereby maintaining functionality while preserving usable space.
Solution Approach 2:
The cuboid modules are designed with universal interconnection interfaces that allow them to be configured in multiple arrangements (stacked, side-by-side, or hybrid configurations). Each module can serve multiple functions depending on its position and connections within the larger system. This multi-functionality enables the system to accommodate increasing component counts and functionality requirements while maintaining efficient space utilization through flexible modular arrangements.
Data Source
AI summary
The described embodiments relate generally to electronic devices and to three dimensional modules for increasing useable space on a circuit board associated therewith. In some embodiments, the modules can have a cuboid geometry, and can include a number of surfaces having embedded circuit traces configured to interconnect electronic components arranged on various surfaces of the module. One of the surfaces of module can include at least one communication interface configured to interconnect the circuit traces on the module to associated circuit paths on a circuit board to which the module is coupled. In some embodiments the module can be operative as a standoff between the circuit board and another component of the electronic device.