3D Deposition Path Planning for Selective Gap Filling

The patent applies local quality by differentiating between necessary void regions and unnecessary gap regions. The system calculates the void ratio and identifies specific gap regions that do not contribute to structural integrity. By selectively filling only necessary voids while leaving unnecessary gaps unfilled, the patent optimizes the local deposition characteristics to achieve the desired overall void ratio without wasting time on redundant filling operations.

The patent implements partial action by determining that complete filling of all void regions is excessive. Instead, it calculates the minimum necessary filling to achieve the target void ratio and stops there. The system identifies gap regions that can be left unfilled without compromising the structural requirements, thus performing only the necessary portion of the filling operation rather than an excessive complete fill of all voids.

The patent applies local quality by varying the discharge amount based on the specific characteristics of each region. For necessary void regions, the discharge amount is increased to ensure proper filling. For unnecessary gap regions, the discharge amount is reduced or set to zero, avoiding wasteful material deposition. This localized control of material discharge optimizes both void ratio achievement and material efficiency.

The patent implements partial action by determining the minimum necessary material deposition to achieve the target void ratio. Instead of uniformly increasing discharge across all regions (which would be excessive), the system selectively increases discharge only where necessary to fill critical voids, leaving unnecessary gaps unfilled. This partial deposition strategy achieves the desired void ratio while minimizing material consumption.