3D Microelectronic Assembly With Non-Solder Die Interconnects
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Solution Overview
Problem
Conventional microelectronic assemblies face challenges in reliably communicating large numbers of signals between multiple integrated circuit (IC) dies due to their small size, thermal constraints, and power delivery limitations, which restricts design flexibility and efficiency.
Innovation Solution
The proposed microelectronic assembly employs a package substrate with conductive pathways and non-solder interconnects, such as anisotropic conductive materials and metal-to-metal interconnects, to securely attach and interconnect multiple IC dies, enabling improved power delivery and signal speed while reducing package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional substrates are used to couple integrated circuit dies, then mechanical stability is achieved, but interconnect pitch is constrained by manufacturing, materials, and thermal considerations
Solution Approach 1:
The patent transitions from planar interconnect architecture to three-dimensional vertical interconnects. Conductive pathways extend through the thickness of the package substrate, enabling signals to travel vertically between dies stacked at different heights. This dimensional change allows higher interconnect density without increasing lateral pitch constraints, effectively resolving the manufacturing precision limitation of conventional substrates.
Solution Approach 2:
Multiple IC dies are nested vertically within a single package substrate, with each die positioned at different heights along the vertical axis. The conductive pathways penetrate through the substrate thickness to electrically connect corresponding pads on different dies. This nesting arrangement enables multiple interconnect layers to coexist in the vertical dimension, dramatically increasing the number of signals that can be transmitted without increasing the package footprint.
2Productivity
If multiple IC dies are coupled to communicate large numbers of signals, then bandwidth is improved, but thermal constraints and power delivery limitations worsen
Solution Approach 1:
The patent distributes heat-generating dies vertically through the package substrate rather than stacking them in a single plane. The conductive pathways extend vertically through the substrate thickness, providing direct thermal conduction paths from each die to the package substrate's heat dissipation structures. This vertical arrangement increases the surface area available for heat dissipation and reduces thermal coupling between adjacent dies, effectively managing thermal constraints while maintaining high signal communication capacity.
3Adaptability or versatility
If conventional interconnect methods are used, then manufacturing is simplified, but design flexibility and efficiency are restricted
Solution Approach 1:
The package substrate is segmented into multiple functional regions, each with dedicated conductive pathways connecting to specific dies. Different interconnect technologies can be employed in different regions of the substrate, allowing optimization for specific signal types or performance requirements. This segmentation enables design flexibility without requiring complete redesign of the entire interconnect system, as individual regions can be modified independently.
Solution Approach 2:
The package substrate serves multiple functions simultaneously: it provides mechanical support for the dies, establishes electrical connections through vertical conductive pathways, manages thermal dissipation, and enables signal routing between multiple dies. This multi-functionality consolidates what would otherwise require separate components into a single integrated structure, maintaining ease of manufacture while dramatically increasing design flexibility and efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for reliable attachment of multiple IC dies with enhanced power efficiency, higher bandwidth, and greater design flexibility, particularly suitable for small and low-profile applications like wearable devices and industrial robots.
Implementation Method 1
first conductive contacts are coupled to conductive pathways in the package substrate by first non-solder interconnects
Implementation Method 2
metal-to-metal interconnects
Data Source
AI summary
Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface, and a die secured to the package substrate, wherein the die has a first surface and an opposing second surface, the die has first conductive contacts at the first surface and second conductive contacts at the second surface, and the first conductive contacts are coupled to conductive pathways in the package substrate by first non-solder interconnects.