3D Die-Stacking Image Sensor Module for Compact Packaging
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Solution Overview
Problem
Conventional image sensor module package structures employ two-dimensional die-stacking, resulting in longer electrical connections and larger package sizes, which fail to meet the demands for compactness, energy efficiency, and high performance in modern devices.
Innovation Solution
A three-dimensional die-stacking structure for image sensor modules using vertical and horizontal electrical connections established by vertical conductive wires and solder bumps, integrated with an optically transparent substrate and image processor die, reducing electrical connection lengths and enabling direct assembly onto circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a two-dimensional die-stacking structure is employed, then the electrical connections can be established, but the electrical connection length becomes longer and the package size becomes larger
Solution Approach 1:
The patent transitions from a conventional two-dimensional die-stacking structure to a three-dimensional die-stacking structure. The image sensor die and image processor die are stacked vertically with the image processor die positioned beneath the image sensor die, enabling electrical connections through vertical conductive wires that pass through the image sensor die. This dimensional change reduces electrical connection length while maintaining connectivity.
2Ease of operation
If a two-dimensional die-stacking structure is employed, then the electrical connections can be established, but the package area and height increase
Solution Approach 1:
By stacking the image sensor die and image processor die in three dimensions with vertical conductive wires for electrical connections, the patent reduces the horizontal footprint and overall package volume compared to two-dimensional arrangements, while maintaining all necessary electrical connections.
Solution Approach 2:
The image processor die is positioned beneath the image sensor die, with conductive wires extending through the image sensor die to connect to the image processor die. This nested arrangement allows one die to be effectively positioned within the vertical space occupied by the other die, reducing overall package volume.
3Ease of manufacture
If conventional two-dimensional package structure is used, then manufacturing is simpler, but component density per unit area is lower
Solution Approach 1:
The three-dimensional die-stacking structure increases component density by utilizing vertical space. Multiple dies are stacked with conductive wires passing through them, allowing more functional components to be integrated within a smaller footprint area, thereby increasing component density while maintaining manufacturability.
Data Source
AI summary
This invention provides an image sensor module with a three-dimensional die-stacking structure. By filling a conductive material into through silicon vias within at least one image sensor die, and into via holes within an insulating layer, vertical electrical connections are formed between the image sensor die and an image processor buried in the insulating layer. A plurality of solder bumps is formed on a backside of the image sensor module so that the module can be directly assembled onto a circuit board. The image sensor module of this invention is characterized by a wafer-level packaging architecture and a three-dimensional die-stacking structure, which reduces electrical connection lengths within the module and thus reduces an area and height of the whole packaged module.