3D Die Stacking Bonding Structure With Integrated Thermal Paths
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current three-dimensional stacking technologies face challenges in achieving high-density integration with efficient thermal dissipation and reliable electrical connections in stacked semiconductor devices, particularly in hybrid bonding structures.
Innovation Solution
The implementation of hybrid bonding structures with heat dissipating elements integrated into the bonding layers, along with a redistribution layer and conductive terminals, allows for efficient thermal dissipation and reliable electrical connections between stacked semiconductor dies, using materials like copper and thermally conductive materials for enhanced performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If hybrid bonding structures are used for three-dimensional stacking, then high-density integration is achieved, but thermal dissipation becomes insufficient
Solution Approach 1:
The patent merges the bonding structure with heat dissipation functionality by integrating heat dissipation elements directly into the bonding layers between stacked semiconductor devices. This combination allows the bonding structure to simultaneously perform mechanical attachment and thermal management functions, resolving the contradiction between achieving high-density integration and maintaining effective thermal dissipation.
Solution Approach 2:
The bonding structure is designed to serve multiple functions: mechanical bonding of semiconductor devices, electrical connection through conductive elements, and thermal dissipation through integrated heat dissipation elements. This multi-functionality allows a single structure to address multiple requirements simultaneously, including both high-density integration and thermal management.
2Temperature
If bonding layers are added for thermal dissipation, then thermal management improves, but device complexity increases
Solution Approach 1:
Instead of adding separate bonding layers and separate heat dissipation structures, the patent combines these functions into a single integrated bonding structure. The heat dissipation elements are incorporated directly into the bonding layers, eliminating the need for additional separate components and reducing overall structural complexity while maintaining thermal management capabilities.
3Temperature
If heat dissipating elements are integrated into bonding structures, then thermal dissipation improves, but manufacturing complexity increases
Solution Approach 1:
The heat dissipation elements are formed and positioned within the bonding structures during the bonding process itself, before final assembly of the stacked semiconductor devices. This preliminary formation of heat dissipation structures simplifies manufacturing by avoiding post-assembly modifications and integrating thermal management into the existing bonding fabrication flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables improved thermal dissipation and maintains reliable electrical connections, enhancing the production yield and reliability of three-dimensional stacking structures by integrating heat dissipating elements within the bonding structures and using thermally conductive materials.
Implementation Method 1
heat dissipating elements integrated into the bonding layers
Data Source
AI summary
A stacking structure including a first die, a second die stacked on the first die, and a filling material is provided. The first die has a first bonding structure, and the first bonding structure includes first bonding pads and a first heat dissipating element. The second die has a second bonding structure, and the second bonding structure includes second bonding pads and a second heat dissipating element. The first bonding pads are bonded with the second bonding pads. The first heat dissipating element is connected to one first bonding pad of the first bonding pads and the second heat dissipating element is connected to one second bonding pad of the second bonding pads. The filling material is disposed over the first die and laterally around the second die. The first and second dies are bonded through the first and second bonding structures.