3D Die Assembly With Vacuum Gap for Low-Loss Interconnects
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Solution Overview
Problem
Existing 3D electronic die assemblies face challenges in limiting thermal conduction, electrical losses, and crosstalk, particularly in applications involving different operating temperatures, with conventional dielectric materials and superconducting interconnections failing to address these issues effectively.
Innovation Solution
An electronic die assembly design featuring superimposed dies with direct connections between bonding pads and conductive tracks, separated by a solid matter-free gap, utilizing superconducting materials for pads and stripped side walls on conductive tracks to reduce thermal conduction and electrical resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional dielectric materials are used to connect the two dies, then electrical conduction is achieved, but thermal conduction and electrical losses increase
Solution Approach 1:
The patent removes the dielectric material that was traditionally used to fill the gap between bonding pads and conductive tracks. By extracting this material, the source of dielectric losses and thermal conduction is eliminated, while electrical conduction is maintained through direct metal-to-metal contact between the bonding pads and tracks.
Solution Approach 2:
The patent introduces a vacuum or gas-filled gap as an intermediary between the bonding pads and conductive tracks, replacing the conventional dielectric material. This intermediary medium provides electrical insulation while minimizing thermal conduction and eliminating dielectric losses, yet allows direct electrical contact through the bonding interface.
2Loss of energy
If superconducting interconnection pads are used, then thermal conduction is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent combines the bonding pad and conductive track into a single continuous superconducting structure, eliminating the need for separate dielectric layers and complex multi-layer interconnection structures. This merging simplifies manufacturing while maintaining the thermal isolation benefits of superconducting materials.
Solution Approach 2:
The superconducting bonding pad serves multiple functions simultaneously: it provides electrical connection, thermal isolation through its superconducting properties, and structural support. This multi-functionality reduces the need for additional specialized components and simplifies the overall device architecture.
3Loss of energy
If bonding pads are directly connected to conductive tracks without dielectric material, then thermal conduction and electrical losses are reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the gap region into discrete bonding pad locations with defined geometries, allowing for precise alignment and registration. By defining specific bonding interfaces with controlled dimensions and positions, the manufacturing process can achieve the required precision through standardized fabrication steps and alignment markers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly reduces thermal conduction, electrical losses, and crosstalk, enhancing performance in quantum computing and RF applications by maintaining low temperatures and minimizing dielectric losses.
Implementation Method 1
a solid matter-free gap separates the last interconnection level of the first die from the second die
Implementation Method 2
utilizing superconducting materials for pads and stripped side walls on conductive tracks to reduce thermal conduction and electrical resistance
Data Source
AI summary
An electronic die assembly includes a first die and a second die superimposed on and electrically and mechanically connected to each other, the first die including a first interconnection structure and the second die including a second interconnection structure, the first interconnection structure and the second interconnection structure each including superimposed interconnection levels; first bonding pads disposed on the first interconnection structure; and second bonding pads disposed on the second interconnection structure, the second bonding pads being bonded to the first bonding pads; in which assembly: the last interconnection level of the first die comprises first conductive tracks; at least part of the first bonding pads are directly connected to the first conductive tracks; and a solid matter-free gap separates the last interconnection level of the first die from the second die and extends between at least part of the first conductive tracks.