3D Fabricated Electronic Device Assembly With Dual-Resin Printing

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Solution Overview

Problem

Existing methods for producing three-dimensionally fabricated objects with conductors face limitations due to the physical properties of UV curable resins, which affect electrical characteristics and increase production costs.

Innovation Solution

A production method and device that separate the fabrication of the object and electronic device into distinct steps, allowing for the use of different UV curable resins with tailored properties in each step, thereby alleviating limitations on resin selection and reducing production costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single UV curable resin is used for both the attached object and electronic device fabrication, then the production process is simplified, but the physical properties are limited and cannot be optimized for both applications

Engineering Contradiction:
Improveproduction processVSAvoidresin selection flexibility
Core Design Contradiction:
Device complexityVSAdaptability or versatility

Solution Approach 1:

The patent divides the fabrication process into two separate steps: first fabricating the attached object, then fabricating the electronic device. This segmentation allows different UV curable resins to be used in each step, optimizing physical properties for each specific application while maintaining production efficiency.

Inventive Principle:
Principle #1Segmentation

2Reliability

If UV curable resin with optimized physical properties is selected for electronic device fabrication, then electrical characteristics improve, but the resin selection for attached object fabrication becomes constrained

Engineering Contradiction:
Improveelectrical characteristicsVSAvoidresin selection freedom
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

By separating the fabrication into distinct steps, the patent enables independent resin selection for each application. The electronic device can use resin optimized for electrical characteristics, while the attached object can use resin with different properties suited for its specific requirements.

Inventive Principle:
Principle #1Segmentation

3Ease of manufacture

If the same resin is used throughout the fabrication process, then production cost is reduced, but the ability to optimize for specific application requirements is lost

Engineering Contradiction:
Improveproduction costVSAvoidapplication-specific optimization
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The two-step fabrication process allows for application-specific resin optimization without significantly increasing production cost. Each resin can be selected and optimized for its specific use case, improving overall manufacturing precision and performance.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the degree of freedom in selecting UV curable resins, improves electrical characteristics, and reduces production costs by optimizing resin properties for each fabrication step.

Implementation Method 1

a UV curable composition is discharged from an ink jet printer, and then the discharged UV curable composition is irradiated with UV light and cured

Methodology Applied
Scientific EffectPhotopolymerisation: Photopolymerisation

Data Source

PatentEP4249250B1Production method and production device for three-dimensionally fabricated object
Publication Date: 2026.01.21 FUJI CORP
  • EP4249250B1 patent drawingFigure 1
  • EP4249250B1 patent drawingFigure 2
  • EP4249250B1 patent drawingFigure 3

AI summary

To provide a production method and a production device for a three-dimensionally fabricated object that can alleviate a limitation on a curable resin to be used, in a case where the three-dimensionally fabricated object having an electronic device is produced using an additive manufacturing method. A production method for a three-dimensionally fabricated object of the present disclosure includes a first fabricating step of fabricating the attached object including an attachment section, to which the electronic device is attachable, with a first curable resin, using an additive manufacturing method, a second fabricating step of fabricating a resin layer with a second curable resin, fabricating a conductor with a fluid containing a metal particle, and fabricating the electronic device having the conductor in the resin layer, using the additive manufacturing method, and an attaching step of attaching the electronic device to the attachment section of the attached object.