3D Electronic Device Manufacturing In-Situ Light Curing
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Solution Overview
Problem
The existing methods for forming three-dimensional electronic devices using the inkjet method face challenges such as repeated thermal expansion and shrinkage, leading to defects like cracks and peeling due to frequent baking and repositioning of layers.
Innovation Solution
The method involves forming each layer cross-section using multiple materials and solidifying them using ultraviolet light, a laser beam, or an electron beam, allowing for in-place curing and minimizing deformation and thermal issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the work is transferred to a furnace and baked repeatedly for each layer cross section, then the layer cross sections are solidified, but the work undergoes repeated thermal expansion and shrinkage causing cracks and peeling
Solution Approach 1:
The patent replaces the thermal field (furnace baking) with a light field (ultraviolet light, laser beam, visible light, or electron beam) to solidify the layer cross sections. This substitution eliminates repeated heating and cooling cycles, preventing thermal expansion and shrinkage that cause cracks and peeling, while achieving the same solidification objective.
Solution Approach 2:
The patent introduces a light-curable or electron beam-curable material as an intermediary that enables solidification without thermal processing. This material layer is deposited and then solidified in place using electromagnetic radiation, serving as a mediator that avoids direct thermal contact and the associated harmful thermal effects.
2Manufacturing precision
If the work is transferred to a furnace and baked for each layer cross section, then the layer cross sections are solidified, but positioning of the work must be performed many times
Solution Approach 1:
The work is positioned once at the beginning, and subsequent layer cross sections are solidified in place without requiring repositioning. This preliminary positioning action eliminates the need for repeated positioning operations that would otherwise be required for each furnace baking cycle, improving both precision and productivity.
Solution Approach 2:
The patent combines the deposition and solidification processes into a single in-situ operation. By solidifying each layer cross section at its deposition location using light or electron beam, the process merges what were previously separate steps (transfer, position, bake, return), eliminating multiple positioning cycles.
3Reliability
If the work is baked many times, then the layer cross sections are solidified, but the defect occurrence rate increases due to repeated thermal expansion and shrinkage
Solution Approach 1:
The patent replaces the complex thermal processing system (furnace, heating elements, temperature control) with a simpler light or electron beam system. This substitution reduces the number of baking cycles from multiple sequential operations to a single in-situ solidification step, decreasing device complexity and improving reliability by eliminating thermal cycling defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the need for frequent repositioning and minimizes defects by localizing the curing process, thereby reducing thermal expansion and shrinkage-related issues, improving productivity and reducing the defect occurrence rate.
Implementation Method 1
a solidifying means (solidifying process) which, each time a layer cross section is formed by the cross section forming means (cross section forming process), cures or sinters the cross section by exposing the cross section to one of ultraviolet light, a laser beam, visible light, or an electron beam
Data Source
AI summary
When manufacturing three-dimensional electronic device by layering multiple layer cross sections sliced at a predetermined thickness of three-dimensional electronic device which is the target for forming, first, each layer cross section using multiple types of materials is formed by being layered on top of the layer cross section underneath, and each time a layer cross section is formed, the cross section is cured or sintered by being exposed to ultraviolet light, a laser beam, visible light, and so on. The forming method for each cross section may be forming cross section by discharging a binder via a droplet discharge method such as inkjet printing or dispensing, or by spreading a layer of powdered material and bonding the powdered material by discharging a binder or sintering it by exposing it to a laser beam.